D12312SVTEBL25 Renesas Electronics America, D12312SVTEBL25 Datasheet - Page 741

IC H8S MCU ROMLESS 100-QFP

D12312SVTEBL25

Manufacturer Part Number
D12312SVTEBL25
Description
IC H8S MCU ROMLESS 100-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheets

Specifications of D12312SVTEBL25

Core Processor
H8S/2000
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
POR, PWM, WDT
Number Of I /o
70
Program Memory Type
ROMless
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Program Memory Size
-
Other names
HD6412312SVTEBL25
HD6412312SVTEBL25
(2) Programming/Erasing Initialization
The on-chip programming/erasing program to be downloaded includes the initialization program.
The specified period pulse must be applied when programming or erasing. The specified pulse
width is made by the method in which wait loop is configured by the CPU instruction. The
operating frequency of the CPU must be set.
The initial program is set as a parameter of the programming/erasing program which has
downloaded these settings.
(a) Flash programming/erasing frequency parameter (FPEFEQ: general register ER0 of
This parameter sets the operating frequency of the CPU.
The operating frequency range of this LSI is 2 MHz to 25 MHz.
Bits 31 to 16—Reserved: Only 0 may be written to these bits.
Bit
Initial value :
R/W
Bit
Initial value :
R/W
Bit
Initial value :
R/W
Bit
Initial value :
R/W
CPU)
:
:
:
:
:
:
:
:
R/W
R/W
F15
F7
31
23
15
0
0
7
R/W
R/W
F14
F6
30
22
14
0
0
6
R/W
R/W
F13
29
21
13
F5
0
0
5
R/W
R/W
F12
F4
28
20
12
0
0
4
Rev.7.00 Feb. 14, 2007 page 707 of 1108
R/W
R/W
F11
F3
27
19
11
0
0
3
R/W
R/W
F10
F2
26
18
10
0
0
2
REJ09B0089-0700
R/W
R/W
Section 17 ROM
25
17
F9
F1
0
0
9
1
R/W
R/W
F8
24
16
F0
0
0
8
0

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