D12312SVTEBL25 Renesas Electronics America, D12312SVTEBL25 Datasheet - Page 502

IC H8S MCU ROMLESS 100-QFP

D12312SVTEBL25

Manufacturer Part Number
D12312SVTEBL25
Description
IC H8S MCU ROMLESS 100-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheets

Specifications of D12312SVTEBL25

Core Processor
H8S/2000
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
POR, PWM, WDT
Number Of I /o
70
Program Memory Type
ROMless
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Program Memory Size
-
Other names
HD6412312SVTEBL25
HD6412312SVTEBL25
Section 12 Serial Communication Interface (SCI)
Figure 12.6 shows an example of the operation for transmission in asynchronous mode.
Rev.7.00 Feb. 14, 2007 page 468 of 1108
REJ09B0089-0700
TDRE
TEND
TXI interrupt
request generated
1
Start
bit
Figure 12.6 Example of Transmit Operation in Asynchronous Mode
0
Data written to TDR and
TDRE flag cleared to 0 in
TXI interrupt handling routine
D0
(Example with 8-Bit Data, Parity, One Stop Bit)
D1
1 frame
Data
D7
Parity
bit
0/1
TXI interrupt
request generated
Stop
bit
1
Start
bit
0
D0
D1
Data
D7
Parity
bit
0/1
TEI interrupt
request generated
Stop
bit
1
Idle state
(mark state)
1

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