DF2238RTF6 Renesas Electronics America, DF2238RTF6 Datasheet - Page 811

MCU 2.2/3V 256K 100-TQFP

DF2238RTF6

Manufacturer Part Number
DF2238RTF6
Description
MCU 2.2/3V 256K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2200r
Datasheet

Specifications of DF2238RTF6

Core Processor
H8S/2000
Core Size
16-Bit
Speed
6MHz
Connectivity
I²C, SCI, SmartCard
Peripherals
POR, PWM, WDT
Number Of I /o
72
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
2.2 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Other names
HD64F2238RTF6
HD64F2238RTF6

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF2238RTF6V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
V
FWE
MD2 to MD0 *
RES
SWE1 bit
φ
Notes:
CC
Period during which flash memory access is prohibited
(t
Period during which flash memory can be programmed
(Execution of program in flash memory prohibited, and data reads other than verify operations
prohibited)
1.
2.
3.
sswe
Figure 20.15 Power-On/Off Timing (User Program Mode)
Except when switching modes, the level of the mode pins (MD2 to MD0) must be fixed until
power-off by pulling the pins up or down.
See sections 27.2.6, 27.3.6, 27.4.6, 27.5.6 and 27.6.6, Flash Memory Characteristics.
Mode programming setup time t
: Wait time after setting SWE1 bit) *
1
t
OSC1
t
MDS
SWE1 set
Wait time:
*
3
MDS
2
(min) = 200 ns.
t
sswe
Programming/
erasing
possible
Section 20 Flash Memory (F-ZTAT Version)
Rev. 6.00 Mar. 18, 2010 Page 749 of 982
Wait time:
SWE1 cleared
100 μs
min 0 μs
REJ09B0054-0600

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