MC68HC916Y3CFT16 Freescale Semiconductor, MC68HC916Y3CFT16 Datasheet - Page 227

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MC68HC916Y3CFT16

Manufacturer Part Number
MC68HC916Y3CFT16
Description
IC MCU 96K FLASH 16MHZ 160-QFP
Manufacturer
Freescale Semiconductor
Series
HC16r
Datasheet

Specifications of MC68HC916Y3CFT16

Core Processor
CPU16
Core Size
16-Bit
Speed
16MHz
Connectivity
EBI/EMI, SCI, SPI
Peripherals
POR, PWM, WDT
Number Of I /o
60
Program Memory Size
96KB (96K x 8)
Program Memory Type
FLASH
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
160-QFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
MC68HC16Y3/916Y3
USER’S MANUAL
The current out of the pin (I
equation:
where:
V
V
ELECTRICAL CHARACTERISTICS.
R
The current into (I
parasitic bipolar transistor (1/K
One way to minimize the impact of stress conditions on the ADC is to apply voltage
limiting circuits such as diodes to supply and ground. However, leakage from such cir-
cuits and the potential influence on the sampled voltage to be converted must be con-
sidered. Refer to Figure 10-8.
STRESS
BE
STRESS
= Parasitic bipolar base/emitter voltage (refer to V
= Adjustable voltage source
= Source impedance (10K resistor in Figure 10-7 on stressed channel)
Figure 10-7 Input Pin Subjected to Negative Stress
VDD
IN
) the neighboring pin is determined by the 1/K
NEGATIVE
VOLTAGE
ANALOG-TO-DIGITAL CONVERTER
STRESS
+
OUT
N
) under negative stress is determined by the following
I
‹‹1).
OUT
R
R
ADJACENT
STRESS
=
10K
------------------------------------------ -
V
STRESS
I
OUT
I
IN
R
STRESS
PARASITIC
DEVICE
V
PIN UNDER
ADJACENT
STRESS
BE
PINS
NEGCLAMP
in APPENDIX A
N
(Gain) of the
MOTOROLA
ADC PAR STRESS CONN
10-19

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