HD6417750SBP200 Renesas Electronics America, HD6417750SBP200 Datasheet - Page 665

IC SUPERH MPU ROMLESS 256BGA

HD6417750SBP200

Manufacturer Part Number
HD6417750SBP200
Description
IC SUPERH MPU ROMLESS 256BGA
Manufacturer
Renesas Electronics America
Series
SuperH® SH7750r
Datasheet

Specifications of HD6417750SBP200

Core Processor
SH-4
Core Size
32-Bit
Speed
200MHz
Connectivity
EBI/EMI, FIFO, SCI, SmartCard
Peripherals
DMA, POR, WDT
Number Of I /o
28
Program Memory Type
ROMless
Ram Size
24K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 2.07 V
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
256-BGA
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Program Memory Size
-
Data Converters
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD6417750SBP200
Manufacturer:
HITACHI
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Part Number:
HD6417750SBP200
Manufacturer:
RENESAS/瑞萨
Quantity:
20 000
In dual address mode, data corresponding to the size specified by CHCRn.TS is read from the
transfer source in the data read cycle, and, in the data write cycle, it is transferred in two bus
cycles in order to write in the transfer destination the data corresponding to the size specified by
CHCRn.TS. In this process, the transfer data is temporarily stored in the data buffer in the bus
state controller (BSC).
In a transfer between external memories such as that shown in figure 14.7, data is read from
external memory into the BSC's data buffer in the read cycle, then written to the other external
memory in the write cycle. Figure 14.8 shows the timing for this operation. The DACK output
timing is the same as that of CSn in a read or write cycle specified by the CHCRn.AM bit.
Taking the SAR value as the address, data is read from the transfer source module
and stored temporarily in the data buffer in the bus state controller (BSC).
Taking the DAR value as the address, the data stored in the BSC's data buffer is
written to the transfer destination module.
DMAC
DMAC
BSC
BSC
Data buffer
Data buffer
Figure 14.7 Operation in Dual Address Mode
SAR
DAR
SAR
DAR
2nd bus cycle
1st bus cycle
Section 14 Direct Memory Access Controller (DMAC)
Rev.7.00 Oct. 10, 2008 Page 579 of 1074
Transfer destination
Transfer destination
Transfer source
Transfer source
Memory
Memory
module
module
module
module
REJ09B0366-0700

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