HD6417750SBP200 Renesas Electronics America, HD6417750SBP200 Datasheet - Page 96

• Manufacturer Part Number: HD6417750SBP200
• Description: IC SUPERH MPU ROMLESS 256BGA
• Manufacturer: Renesas Electronics America
• Series: SuperH® SH7750r

Specifications of HD6417750SBP200

• Core Processor: SH-4
• Core Size: 32-Bit
• Speed: 200MHz
• Connectivity: EBI/EMI, FIFO, SCI, SmartCard
• Peripherals: DMA, POR, WDT
• Number Of I /o: 28
• Program Memory Type: ROMless
• Ram Size: 24K x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 2.07 V
• Oscillator Type: External
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 256-BGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Program Memory Size: -
• Data Converters: -

Section 1 Overview
1.3
Rev.7.00 Oct. 10, 2008 Page 10 of 1074
REJ09B0366-0700
Notes: Power must be supplied to the on-chip PLL power supply pins (VDD-PLL1, VDD-PLL2, VSS-PLL1, VSS-PLL2,
RESET
RDY
D41
D38
D40
D39
D15
D14
D13
D12
D11
D10
CS0
CS1
CS6
D47
D32
D46
D33
D45
D34
D44
D35
D43
D36
D42
D37
BS
D0
D1
D2
D3
D4
D5
D9
D6
VDD-CPG, VSS-CPG, VDD-RTC, and VSS-RTC) regardless of whether or not the PLL circuits, crystal oscillation
circuit, and RTC are used.
* Hardware standby request (SH7750S and SH7750R). In the SH7750, pull up to 3.3 V.
Pin Arrangement
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
1
2
3
4
Figure 1.2 Pin Arrangement (256-Pin BGA)
5
RD2
BACK/BSREQ
CS5
BREQ/BSACK
CS4
6
7
8
9
(Top view)
BGA256
10
11
12
13
MD2/RXD2
CA *
14
DREQ0
RD/WR2
DREQ1
RXD
15
16
17
18
19
VDDQ (IO)
VSSQ (IO)
VDD (internal)
VSS (internal)
NC
20
IRL2
IRL1
IRL0
MD1/TXD2
MD0/SCK
D63
D48
D62
D49
D61
D50
D60
D51
D59
D52
D58
D53
D57
D54
D56
D55
D31
D16
D30
D17
D29
D18
D28
D19
D27
D20
D26
D21
D25
NMI
IRL3