QT2032-EKG-1A2 Applied Micro Circuits Corporation, QT2032-EKG-1A2 Datasheet - Page 190

• Manufacturer Part Number: QT2032-EKG-1A2
• Manufacturer: Applied Micro Circuits Corporation

Specifications of QT2032-EKG-1A2

• Lead Free Status / RoHS Status: Supplier Unconfirmed

QT2022/32 - Data Sheet: DS3051
Table 61: MDIO AC Parameters
Table 62: RDCC, RDCC_CLK, TDCC, TDCC_CLK AC Parameter Table
Table 63: EEPROM_SDA & EEPROM_SCL 3.3V Bidirectional Pad DC Parameters
190
Tdelay
Fmax
Tdelay
Fmax
Note: delay is measured from MDC rising edge Vih_min level (0.84V) to MDIO rising edge Vih_min level (0.84V) or MDIO falling edge
Vil_max level (0.36V)
fRDCC,
fTDCC
tRDCC_delay
tTDCC_setup
tTDCC_hold
Note
measured to a crossing level of 0.3*Vpullup.
Note
Voh
Vol
Vih
Vil
Cin
Parameter
Parameter
Parameter
1: For an output rising edge, the delay is measured to a crossing level of 0.7*Vpullup. For an output falling edge, the delay is
2: Input timing is measured from the point where input signals cross a voltage level equal to COREVDD/2.
delay from MDC rising edge to MDIO data
output edge
See Note.
MDC clock rate
MDC high and low times
OPERATION UNDER LOW CAPACITIVE LOAD (1.2V pullup)
delay from MDC rising edge to MDIO data
output edge
See Note.
MDC clock rate
MDC high and low times
output high voltage
output low voltage
input high voltage level
input low voltage level
input capacitance
output clock frequency
RDCC output data delay wrt RDCC_CLK
falling edge
TDCC input data setup time wrt
TDCC_CLK falling edge
TDCC input data hold time wrt
TDCC_CLK falling edge
Description
Description
Description
AppliedMicro - Confidential & Proprietary
0
160
0
20
0.1
0.1
Min
0.84
Min
Min
1.9375
Typ
Typ
Typ
300
3.125
32
25.0
Max
0.1
Vpu
0.2
0.4
5
Max
Max
ns
MHz
ns
ns
MHz
ns
Units
V
V
V
V
pF
MHz
μ s
μ s
μ s
Units
Units
RPU=400
Cload=470pF
RPU=400
Cload=470pF
RPU=400
Cload=470pF
RPU=180
Cload=100 pF
Cload=100 pF
RPU=180
Cload=100 pF
RPU=180
sinking 3 mA
3.3V tolerant
See
See
See
Note
Note
Note
Conditions
Ω
Ω
Ω
Ω
Ω
Ω
Conditions
;
;
;
;
;
;
Conditions
1.
2.
2.
Revision 5.11