QT2032-EKG-1A2 Applied Micro Circuits Corporation, QT2032-EKG-1A2 Datasheet - Page 206

• Manufacturer Part Number: QT2032-EKG-1A2
• Manufacturer: Applied Micro Circuits Corporation

Specifications of QT2032-EKG-1A2

• Lead Free Status / RoHS Status: Supplier Unconfirmed

QT2022/32 - Data Sheet: DS3051
Figure 54: Recommended Reflow Profile
206
225 / 260°C
225 / 260°C
220 / 255°C
220 / 255°C
183°C
183°C
150°C
150°C
100°C
100°C
Note: reflow profile for SnPb solder and SnAgCu
Note: reflow profile for SnPb solder and SnAgCu
solder is the same except for peak temperature.
solder is the same except for peak temperature.
Peak temp for SnPb is 225°C; for SnAgCu it is 260°C.
Peak temp for SnPb is 225°C; for SnAgCu it is 260°C.
AppliedMicro - Confidential & Proprietary
1.0-2.0°C/sec : 225°C peak
1.0-2.0°C/sec : 225°C peak
1.5-2.5°C/sec : 260°C peak
1.5-2.5°C/sec : 260°C peak
(183°C to 220°C / 255°C)
(183°C to 220°C / 255°C)
Average ramp-up rate
Average ramp-up rate
Preheat time at
Preheat time at
125 (+/-25)°C
125 (+/-25)°C
60-120s
60-120s
Time above 183°C
Time above 183°C
peak temp
peak temp
Time at
Time at
60-150s
60-150s
10-20s
10-20s
or 260 (+0/-5) °C (SnAgCu)
or 260 (+0/-5) °C (SnAgCu)
220 (+5/-0) °C (PbSn)
220 (+5/-0) °C (PbSn)
Peak temp:
Peak temp:
Average ramp-down rate
Average ramp-down rate
6°C/sec max
6°C/sec max
Revision 5.11