UJA1066TW/5V0,518 NXP Semiconductors, UJA1066TW/5V0,518 Datasheet - Page 62

• Manufacturer Part Number: UJA1066TW/5V0,518
• Manufacturer: NXP Semiconductors

Specifications of UJA1066TW/5V0,518

• Number Of Transceivers: 1
• Power Down Mode: Sleep/Standby
• Standard Supported: ISO 11898-2
• Operating Supply Voltage (min): 5.5V
• Operating Temperature (max): 125C
• Operating Temperature (min): -40C
• Operating Temperature Classification: Automotive
• Mounting: Surface Mount
• Lead Free Status / RoHS Status: Compliant

NXP Semiconductors
12. Package outline
Fig 24. Package outline SOT549-1 (HTSSOP32)
UJA1066_2
Product data sheet
HTSSOP32: plastic thermal enhanced thin shrink small outline package; 32 leads;
body width 6.1 mm; lead pitch 0.65 mm; exposed die pad
DIMENSIONS (mm are the original dimensions).
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
UNIT
mm
E h
VERSION
OUTLINE
SOT549-1
max.
32
1.1
1
A
Z
y
pin 1 index
0.15
0.05
A 1
0.95
0.85
A 2
IEC
0.25
A 3
exposed die pad side
e
0.30
0.19
b p
D h
D
0.20
0.09
c
All information provided in this document is subject to legal disclaimers.
MO-153
JEDEC
11.1
10.9
D
(1)
REFERENCES
Rev. 03 — 17 March 2010
0
D h
5.1
4.9
E
6.2
6.0
b
(2)
p
JEITA
scale
17
16
2.5
E h
3.6
3.4
w
c
M
0.65
e
A 2
High-speed CAN fail-safe system basis chip
5 mm
A 1
H E
8.3
7.9
L
1
0.75
0.50
L p
H E
E
PROJECTION
detail X
EUROPEAN
0.2
v
L
L
p
0.1
w
UJA1066
© NXP B.V. 2010. All rights reserved.
(A 3 )
0.1
y
A
ISSUE DATE
03-04-07
05-11-02
0.78
0.48
θ
X
Z
SOT549-1
A
v
M
8
0
θ
o
o
62 of 70
A