N25Q128A11B1240E NUMONYX, N25Q128A11B1240E Datasheet - Page 120

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N25Q128A11B1240E

Manufacturer Part Number
N25Q128A11B1240E
Description
Manufacturer
NUMONYX
Datasheet

Specifications of N25Q128A11B1240E

Cell Type
NOR
Density
128Mb
Access Time (max)
7ns
Interface Type
Serial (SPI)
Boot Type
Bottom
Address Bus
1b
Operating Supply Voltage (typ)
1.8V
Operating Temp Range
-40C to 85C
Package Type
TBGA
Program/erase Volt (typ)
1.7 to 2/8.5 to 9.5V
Sync/async
Synchronous
Operating Temperature Classification
Industrial
Operating Supply Voltage (min)
1.7V
Operating Supply Voltage (max)
2V
Word Size
8b
Number Of Words
16M
Supply Current
20mA
Mounting
Surface Mount
Pin Count
24
Lead Free Status / Rohs Status
Supplier Unconfirmed
9.2.8
120/185
DQ0
DQ0
DQ1
DQ1
C
S
C
S
Figure 52. Program OTP instruction sequence DIO-SPI
Subsector Erase (SSE)
For devices with bottom or top architecture, at the bottom (or top) of the addressable area
there are 8 boot sectors, each one having 16 4Kbytes subsectors. The Subsector Erase
(SSE) instruction sets to '1' (FFh) all bits inside the chosen subsector. Before it can be
accepted, a Write Enable (WREN) instruction must previously have been executed.
Apart form the parallelizing of the instruction code and the address on the two pins DQ0 and
DQ1, the instruction functionality is exactly the same as the Subsector Erase (SSE)
instruction of the Extended SPI protocol, please refer to
(SSE)
Figure 53. Subsector Erase instruction sequence DIO-SPI
0
Instruction
1
for further details.
2
0
3
Instruction
23 21 19 17
22 20 18 16
4
1
5
2
6
7
3
24-Bit Address
15 13 11 9
14 12 10 8
8
23 21 19 17
22 20 18 16
4
9 10 11
5
6
12 13 14 15
7
6
7
5
4
24-Bit Address
3
2
15 13 11
14 12 10
8
1
0
9
16 17 18 19
7
6
Data Byte 1
5
4
10 11
Section 9.1.17: Subsector Erase
3
2
9
8
1
0
20 21 22 23 24 25 26 27
7
6
12 13 14 15
7
Data Byte 2
6
5
4
5
4
3
2
1
Dual_S ubsector_E rase
0
3
2
Dual_Program_OTP
7
6
Data Byte n
1
0
5
4
3
2
1
0

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