SAM9G10 Atmel Corporation, SAM9G10 Datasheet - Page 619
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SAM9G10
Manufacturer Part Number
SAM9G10
Description
Manufacturer
Atmel Corporation
Datasheets
1.SAM9261.pdf
(1274 pages)
2.SAM9261.pdf
(43 pages)
3.SAM9G10.pdf
(750 pages)
4.SAM9G10.pdf
(39 pages)
Specifications of SAM9G10
Flash (kbytes)
0 Kbytes
Pin Count
217
Max. Operating Frequency
266 MHz
Cpu
ARM926
Hardware Qtouch Acquisition
No
Max I/o Pins
96
Ext Interrupts
96
Usb Transceiver
3
Usb Speed
Full Speed
Usb Interface
Host, Device
Spi
2
Twi (i2c)
1
Uart
4
Ssc
3
Sd / Emmc
1
Graphic Lcd
Yes
Video Decoder
No
Camera Interface
No
Resistive Touch Screen
No
Temp. Sensor
No
Crypto Engine
No
Sram (kbytes)
16
Self Program Memory
NO
External Bus Interface
1
Dram Memory
sdram
Nand Interface
Yes
Picopower
No
Temp. Range (deg C)
-40 to 85
I/o Supply Class
1.8/3.3
Operating Voltage (vcc)
1.08 to 1.32
Fpu
No
Mpu / Mmu
No/Yes
Timers
3
Output Compare Channels
3
Input Capture Channels
3
32khz Rtc
Yes
Calibrated Rc Oscillator
No
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34.8.4
11053B–ATARM–22-Sep-11
11053B–ATARM–22-Sep-11
Write Operation
In write operation, the HSMCI Mode Register (HSMCI_MR) is used to define the padding value
when writing non-multiple block size. If the bit PADV is 0, then 0x00 value is used when padding
data, otherwise 0xFF is used.
If set, the bit DMAEN in the HSMCI_DMA register enables DMA transfer.
The following flowchart
DMA facilities. Polling or interrupt method can be used to wait for the end of write according to
the contents of the Interrupt Mask Register (HSMCI_IMR).
(Figure
34-9) shows how to write a single block with or without use of
SAM9G35
SAM9G35
619
619
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