HYB18L256160B QIMONDA [Qimonda AG], HYB18L256160B Datasheet - Page 54

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HYB18L256160B

Manufacturer Part Number
HYB18L256160B
Description
DRAMs for Mobile Applications 256-Mbit Mobile-RAM
Manufacturer
QIMONDA [Qimonda AG]
Datasheet

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4
Rev. 1.73, 2006-09
01302004-CZ2R-J9SE
Package Outlines
1) A1 Marking Ballside
2) Die Sort Fiducial
3) Bad Unit Marking (BUM)
4) Middle of Packages Edges
5) Middle of Ball Matrix
0.3
D
D
5)
2)
0.41
±0.03
8 x 0.8 = 6.4
A
4)
12
ø0.12
ø0.07
54x
0.8
4.25
M
M
P-VFBGA-54-2 (Plastic Thin Fine Ball Grid Array Package)
0.1
C
54
C
1.5
A
B
2)
3)
B
1)
C
4)
SEATING PLANE
0.2
0.1
C
0.12
HY[B/E]18L256160B[C/F]L-7.5
+0.01
-0.04
20˚
±5˚
256-Mbit Mobile-RAM
FIGURE 48
Data Sheet

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