MC56F8035VLD Freescale Semiconductor, MC56F8035VLD Datasheet - Page 124

• Manufacturer Part Number: MC56F8035VLD
• Description: Digital Signal Processors & Controllers - DSP, DSC 16 BIT DSPHC 64KB
• Manufacturer: Freescale Semiconductor

Specifications of MC56F8035VLD

• Rohs: yes
• Core: 56800E
• Data Bus Width: 16 bit
• Program Memory Size: 64 KB
• Data Ram Size: 8 KB
• Maximum Clock Frequency: 32 MHz
• Number Of Programmable I/os: 35
• Number Of Timers: 3
• Device Million Instructions Per Second: 32 MIPs
• Operating Supply Voltage: 3 V to 3.6 V
• Maximum Operating Temperature: + 105 C
• Package / Case: LQFP-44
• Mounting Style: SMD/SMT

1. Theta-JA determined on 2s2p test boards is frequently lower than would be observed in an application. Determined on 2s2p
2. Junction to ambient thermal resistance, Theta-JA (R
3. Junction to case thermal resistance, Theta-JC (R
4. Junction to board thermal resistance, Theta-JB (R
5. Thermal Characterization Parameter, Psi-JT (Y
6. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
7. See
124
thermal test board.
in a horizontal configuration in natural convection. Theta-JA was also simulated on a thermal test board with two internal planes
(2s2p, where “s” is the number of signal layers and “p” is the number of planes) per JESD51-6 and JESD51-7. The correct name
for Theta-JA for forced convection or with the non-single layer boards is Theta-JMA.
technique with the cold plate temperature used as the “case” temperature. The basic cold plate measurement technique is de-
scribed by MIL-STD 883D, Method 1012.1. This is the correct thermal metric to use to calculate thermal performance when the
package is being used with a heat sink.
board determined per JESD51-8. Board temperature is measured on the top surface of the board near the package.
of case as defined in JESD51-2. Y
environments.
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance.
Section 12.1
Junction to ambient
Natural convection
Junction to ambient
Natural convection
Junction to ambient
(@200 ft/min)
Junction to ambient
(@200 ft/min)
Junction to board
Junction to case
Junction to package top
ESD for Machine Model (MM)
ESD for Charge Device Model (CDM)
Characteristic
for more details on thermal design considerations.
Table 10-3 LQFP Package Thermal Characteristics
Characteristic
Table 10-2 56F8035/56F8025 ESD Protection
JT
is a useful value to use to estimate junction temperature in steady state customer
Single layer board
(1s)
Four layer board
(2s2p)
Single layer board
(1s)
Four layer board
(2s2p)
Natural Convection
56F8035/56F8025 Data Sheet, Rev. 6
Comments
JT
), is the “resistance” from junction to reference point thermocouple on top center
JC
JB
), was simulated to be equivalent to the measured values using the cold plate
), is a metric of the thermal resistance from the junction to the printed circuit
JA
), was simulated to be equivalent to the JEDEC specification JESD51-2
Min
200
750
Symbol
R
R
R
R
R
R
JMA
JMA
JMA
JT
JA
JB
JC
Typ
—
—
(LQFP)
Value
41
34
34
29
24
8
2
Max
—
—
6
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
Freescale Semiconductor
Unit
V
V
Notes
1, 2
1, 2
2
2
4
3
5