MC9S12C128CFUE Freescale Semiconductor, MC9S12C128CFUE Datasheet - Page 684

• Manufacturer Part Number: MC9S12C128CFUE
• Description: IC MCU 128K FLASH 25MHZ 80-QFP
• Manufacturer: Freescale Semiconductor
• Series: HCS12r

Specifications of MC9S12C128CFUE

• Core Processor: HCS12
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: CAN, EBI/EMI, SCI, SPI
• Peripherals: POR, PWM, WDT
• Number Of I /o: 60
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 4K x 8
• Voltage - Supply (vcc/vdd): 2.35 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 80-QFP
• Cpu Family: HCS12
• Device Core Size: 16b
• Frequency (max): 25MHz
• Interface Type: CAN/SCI/SPI
• Total Internal Ram Size: 4KB
• # I/os (max): 60
• Number Of Timers - General Purpose: 8
• Operating Supply Voltage (typ): 2.5/5V
• Operating Supply Voltage (max): 2.75/5.5V
• Operating Supply Voltage (min): 2.35/2.97V
• On-chip Adc: 8-chx10-bit
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 80
• Package Type: PQFP
• Processor Series: S12C
• Core: HCS12
• Data Bus Width: 16 bit
• Data Ram Size: 4000 B
• Maximum Clock Frequency: 25 MHz
• Number Of Programmable I/os: 61
• Number Of Timers: 1
• Operating Supply Voltage: - 0.3 V to + 6.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWHCS12
• Development Tools By Supplier: M68EVB912C32EE
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Compliant

Appendix C Package Information
C.1.3
684
B
B1
9
AB
AC
T
12
1
48-Pin LQFP Package
4X
SECTION AE-AE
0.080
4X
0.200 AC T-U
Figure C-3. 48-Pin LQFP Mechanical Dimensions (Case no. 932-03 issue F)
48
13
S1
0.200 AB T-U
M
BASE METAL
A1
F
D
AC
G
A
S
T-U
N
Z
Z
Z
Z
J
37
24
AD
36
25
MC9S12C-Family / MC9S12GC-Family
U
V1
0.080 AC
DETAIL Y
V
Rev 01.24
C
H
E
DETAIL AD
TOP & BOTTOM
DETAIL Y
M °
AE
W
P
T, U, Z
AE
AA
NOTES:
1.
2.
3.
4.
5.
6.
7.
K
DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
CONTROLLING DIMENSION: MILLIMETER.
DATUM PLANE AB IS LOCATED AT BOTTOM
OF LEAD AND IS COINCIDENT WITH THE
LEAD WHERE THE LEAD EXITS THE PLASTIC
BODY AT THE BOTTOM OF THE PARTING
LINE.
DATUMS T, U, AND Z TO BE DETERMINED AT
DATUM PLANE AB.
DIMENSIONS S AND V TO BE DETERMINED
AT SEATING PLANE AC.
DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION. ALLOWABLE
PROTRUSION IS 0.250 PER SIDE. DIMENSIONS
A AND B DO INCLUDE MOLD MISMATCH AND
ARE DETERMINED AT DATUM PLANE AB.
DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE D DIMENSION TO EXCEED
0.350.
R
DIM
AA
A1
B1
V1
S1
W
G
H
K
M
A
B
C
D
E
F
L
N
P
R
V
J
S
MILLIMETERS
1.400
0.170
1.350
0.170
0.050
0.090
0.500
0.090
0.150
MIN
L °
0
7.000 BSC
3.500 BSC
7.000 BSC
3.500 BSC
0.500 BSC
0.250 BSC
9.000 BSC
4.500 BSC
9.000 BSC
4.500 BSC
0.200 REF
1.000 REF
12 REF
°
°
Freescale Semiconductor
1.600
0.270
1.450
0.230
0.150
0.200
0.700
0.160
0.250
MAX
7
°