MCHC912B32CFUE8 Freescale Semiconductor, MCHC912B32CFUE8 Datasheet - Page 326

IC MCU 32K FLASH 8MHZ 80-QFP

MCHC912B32CFUE8

Manufacturer Part Number
MCHC912B32CFUE8
Description
IC MCU 32K FLASH 8MHZ 80-QFP
Manufacturer
Freescale Semiconductor
Series
HC12r
Datasheet

Specifications of MCHC912B32CFUE8

Core Processor
CPU12
Core Size
16-Bit
Speed
8MHz
Connectivity
SCI, SPI
Peripherals
POR, PWM, WDT
Number Of I /o
63
Program Memory Size
32KB (32K x 8)
Program Memory Type
FLASH
Eeprom Size
768 x 8
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
80-QFP
Cpu Family
HC12
Device Core Size
16b
Frequency (max)
8MHz
Interface Type
SCI/SPI
Total Internal Ram Size
1KB
# I/os (max)
63
Operating Supply Voltage (typ)
5V
Operating Supply Voltage (max)
5.5V
Operating Supply Voltage (min)
4.5V
On-chip Adc
8-chx10-bit
Instruction Set Architecture
CISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
80
Package Type
PQFP
Package
80PQFP
Family Name
HC12
Maximum Speed
8 MHz
Operating Supply Voltage
5 V
Data Bus Width
16 Bit
Number Of Programmable I/os
63
Processor Series
HC912B
Core
HC12
Data Ram Size
1 KB
Maximum Clock Frequency
8 MHz
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWHCS12
Development Tools By Supplier
M68EVB912B32E
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MCHC912B32CFUE8
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Company:
Part Number:
MCHC912B32CFUE8
Quantity:
300
Electrical Specifications
19.16 Multiplexed Expansion Bus Timing
326
Num
1. V
2. All timings are calculated for normal port drives.
3. Crystal input is required to be within 45% to 55% duty.
4. Reduced drive must be off to meet these timings.
5. Unequalled loading of pins will affect relative timing numbers.
6. This characteristic is affected by clock stretch.
7. Without TAG enabled
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
1
2
3
5
7
8
9
Add N × t
DD
Frequency of operation (E-clock frequency)
Cycle timet
Pulse width, E lowPW
Pulse width, E high
Address delay timet
Address valid time to ECLK riset
Multiplexed address hold timet
Address hold to data valid
Data hold to high impedancet
Read data setup time
Read data hold time
Write data delay time
Write data hold time
Write data setup time
Read/write delay timet
Read/write valid time to E riset
Read/write hold time
Low strobe
Low strobe
Low strobe
Address access time
Access time from E rise
DBE delay from ECLK rise
DBE valid timet
DBE hold time from ECLK fall
= 5.0 Vdc ± 10%, V
cyc
where N = 0, 1, 2, or 3, depending on the number of clock stretches.
Use of the multiplexed expansion bus at 8 MHz is discouraged due to TAD
delay factors.
(7)
(7)
(7)
cyc
delay timet
valid time to E riset
hold time
= 1/f
DBE
Characteristic
o
(6)
AD
= PW
SS
(6)
PW
(6)
EL
RWD
= t
= 0 Vdc, T
t
t
(6)
DSW
ACCA
= t
LSD
EH
EH
cyc
t
(6)
cyc
= t
ACCE
= t
/4 + delay
− t
= t
= PW
DHZ
t
cyc
/2 + delay
= t
DBED
MAH
RWV
cyc
DBED
cyc
(1), (2), (3), (4), (5)
AV
/4 + delay
cyc
= PW
LSV
/2 + delay
A
= t
/4 + delay
EH
M68HC12B Family Data Sheet, Rev. 9.1
= t
= T
= PW
= PW
− t
= t
AD
= PW
cyc
− t
AD
cyc
EH
L
− 20
to T
/4 + delay
DDW
EL
EL
/4 + delay
− t
− t
EL
− t
− t
DSR
DSR
H
− t
, unless otherwise noted
AD
RWD
LSD
NOTE
Delay
−18
−4
−2
27
18
18
8
Symbol
PW
PW
t
t
t
t
t
t
t
t
t
t
t
t
t
t
AHDS
t
t
t
ACCA
ACCE
DBED
t
DBEH
t
DDW
DHW
DSW
RWD
RWV
RWH
t
MAH
DHR
t
DHZ
DSR
DBE
t
LSD
LSV
LSH
cyc
AD
f
AV
o
EH
EL
–6.2
31.2
11.8
Min
125
5.8
3.8
3.8
dc
59
59
13
30
25
25
25
–3
0
8 MHz
Max
67.5
45.2
62.5
57.5
57.5
27.6
27.8
57.5
Freescale Semiconductor
8.0
10
Min
500
246
248
107
103
103
115
94
20
25
20
83
20
20
–3
dc
0
2 MHz
Max
152
132
165
143
143
323
223
133
8.0
10
MHz
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns

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