MPC8572CLPXARLD FREESCALE [Freescale Semiconductor, Inc], MPC8572CLPXARLD Datasheet - Page 100

• Manufacturer Part Number: MPC8572CLPXARLD
• Description: MPC8572E PowerQUICC III Integrated Processor Hardware Specifications
• Manufacturer: FREESCALE [Freescale Semiconductor, Inc]

Package Description
18 Package Description
This section describes package parameters, pin assignments, and dimensions.
18.1
The package parameters are as provided in the following list. The package type is 33 mm × 33 mm, 1023
flip chip plastic ball grid array (FC-PBGA).
100
Package outline
Interconnects
Ball Pitch
Ball Diameter (Typical)
Solder Balls
Solder Balls (Lead-Free)
Package Parameters for the MPC8572E FC-PBGA
MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 4
33 mm × 33 mm
1023
1 mm
0.6 mm
63% Sn
37% Pb
96.5% Sn
3.5% Ag
Freescale Semiconductor