MPC8572CLPXARLD FREESCALE [Freescale Semiconductor, Inc], MPC8572CLPXARLD Datasheet - Page 123

• Manufacturer Part Number: MPC8572CLPXARLD
• Description: MPC8572E PowerQUICC III Integrated Processor Hardware Specifications
• Manufacturer: FREESCALE [Freescale Semiconductor, Inc]

20.1
The MPC8572E has a temperature diode on the microprocessor that can be used in conjunction with other
system temperature monitoring devices (such as Analog Devices, ADT7461™). These devices use the
negative temperature coefficient of a diode operated at a constant current to determine the temperature of
the microprocessor and its environment. It is recommended that each MPC8572E device be calibrated.
The following are the specifications of the on-board temperature diode:
An approximate value of the ideality may be obtained by calibrating the device near the expected
operating temperature.
Ideality factor is defined as the deviation from the ideal diode equation:
Another useful equation is:
Where:
Freescale Semiconductor
Junction to case
Notes:
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
2. Per JEDEC JESD51-2 with the single-layer board (JESD51-3) horizontal.
3. Per JEDEC JESD51-6 with the board (JESD51-7) horizontal.
4. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured
5. Thermal resistance between the active surface of the die and the case top surface determined by the cold plate method
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance
on the top surface of the board near the package.
(MIL SPEC-883, Method 1012.1).
V
V
V
Operating range 2–300 μA
Diode leakage < 10 nA @ 125°C
I
I
V
H
fw
s
f
f
d
I
fw
– V
= Saturation current
> 0.40 V
< 0.90 V
= Voltage at diode
= Forward current
Temperature Diode
= I
L
= n
s
MPC8572E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 4
e
KT
__
q
Rating
___
nKT
qV
ln
f
Table 83. Package Thermal Characteristics (continued)
__
– 1
I
I
L
H
Board
—
Symbol
R
ΘJC
Value
0.5
°
Unit
C/W
Notes
Thermal
5
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