MC9S08QD4VSC Freescale Semiconductor, MC9S08QD4VSC Datasheet - Page 174

• Manufacturer Part Number: MC9S08QD4VSC
• Description: IC MCU 4K FLASH 256RAM 8-SOIC
• Manufacturer: Freescale Semiconductor
• Series: HCS08r

Specifications of MC9S08QD4VSC

• Core Processor: HCS08
• Core Size: 8-Bit
• Speed: 10MHz
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 4
• Program Memory Size: 4KB (4K x 8)
• Program Memory Type: FLASH
• Ram Size: 256 x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 4x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 8-SOIC (3.9mm Width)
• Processor Series: S08QD
• Core: HCS08
• Data Bus Width: 8 bit
• Data Ram Size: 256 B
• Interface Type: I2C, SCI, SPI
• Maximum Clock Frequency: 8 MHz
• Number Of Programmable I/os: 4
• Number Of Timers: 3
• Operating Supply Voltage: 2.7 V to 5.5 V
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWS08
• Development Tools By Supplier: DEMO9S08QD4
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 4-ch x 10-bit
• Cpu Family: HCS08
• Device Core Size: 8b
• Frequency (max): 8MHz
• Total Internal Ram Size: 256Byte
• # I/os (max): 4
• Number Of Timers - General Purpose: 3
• Operating Supply Voltage (typ): 3.3/5V
• Operating Supply Voltage (max): 5.5V
• Operating Supply Voltage (min): 2.7V
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 105C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 8
• Package Type: SOIC N
• For Use With: DEMO9S08QD4 - BOARD DEMO FOR MC9S08QD FAMILY
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Connectivity: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Appendix A Electrical Characteristics
A.3
This section provides information about operating temperature range, power dissipation, and package
thermal resistance. Power dissipation on I/O pins is usually small compared to the power dissipation in
on-chip logic and voltage regulator circuits and it is user-determined rather than being controlled by the
MCU design. In order to take P
actual pin voltage and V
unusually high pin current (heavy loads), the difference between pin voltage and V
small.
The average chip-junction temperature (T
where:
For most applications, P
(if P
Solving
where K is a constant pertaining to the particular part. K can be determined from equation 3 by measuring
P
solving
174
D
(at equilibrium) for a known T
I/O
T
θ
P
P
P
JA
D
int
I/O
A
is neglected) is:
Equation A-1
= Ambient temperature, °C
= P
Equation A-1
= Package thermal resistance, junction-to-ambient, °C/W
= I
= Power dissipation on input and output pins — user determined
Thermal Characteristics
int
DD
Operating temperature range
(packaged)
Maximum junction temperature
Thermal resistance (single-layer board)
Thermal resistance (four-layer board)
+ P
× V
8-pin PDIP
8-pin NB SOIC
8-pin PDIP
8-pin NB SOIC
I/O
DD
, Watts — chip internal power
and
and
I/O
SS
Equation A-2
Equation A-2
or V
<< P
Rating
K = P
I/O
DD
int
MC9S08QD4 Series MCU Data Sheet, Rev. 6
A
into account in power calculations, determine the difference between
and can be neglected. An approximate relationship between P
and multiply by the pin current for each I/O pin. Except in cases of
. Using this value of K, the values of P
Table A-2. Thermal Characteristics
D
P
T
× (T
D
J
iteratively for any value of T
for K gives:
= K ÷ (T
= T
J
A
) in °C can be obtained from:
+ 273°C) + θ
A
+ (P
J
D
+ 273°C)
× θ
JA
JA
Symbol
)
T
θ
θ
× (P
JMax
T
JA
JA
A
D
)
2
A
–40 to 125
.
T
Value
L
135
113
150
72
87
D
to T
and T
H
J
SS
can be obtained by
Freescale Semiconductor
or V
°C/W
°C/W
Unit
°C
°C
DD
will be very
D
Eqn. A-1
Eqn. A-2
Eqn. A-3
and T
J