MC9S08QD4VSC Freescale Semiconductor, MC9S08QD4VSC Datasheet - Page 178

• Manufacturer Part Number: MC9S08QD4VSC
• Description: IC MCU 4K FLASH 256RAM 8-SOIC
• Manufacturer: Freescale Semiconductor
• Series: HCS08r

Specifications of MC9S08QD4VSC

• Core Processor: HCS08
• Core Size: 8-Bit
• Speed: 10MHz
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 4
• Program Memory Size: 4KB (4K x 8)
• Program Memory Type: FLASH
• Ram Size: 256 x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 4x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 8-SOIC (3.9mm Width)
• Processor Series: S08QD
• Core: HCS08
• Data Bus Width: 8 bit
• Data Ram Size: 256 B
• Interface Type: I2C, SCI, SPI
• Maximum Clock Frequency: 8 MHz
• Number Of Programmable I/os: 4
• Number Of Timers: 3
• Operating Supply Voltage: 2.7 V to 5.5 V
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWS08
• Development Tools By Supplier: DEMO9S08QD4
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 4-ch x 10-bit
• Cpu Family: HCS08
• Device Core Size: 8b
• Frequency (max): 8MHz
• Total Internal Ram Size: 256Byte
• # I/os (max): 4
• Number Of Timers - General Purpose: 3
• Operating Supply Voltage (typ): 3.3/5V
• Operating Supply Voltage (max): 5.5V
• Operating Supply Voltage (min): 2.7V
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 105C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 8
• Package Type: SOIC N
• For Use With: DEMO9S08QD4 - BOARD DEMO FOR MC9S08QD FAMILY
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Connectivity: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

7
Appendix A Electrical Characteristics
178
Power supply must maintain regulation within operating V
conditions. If positive injection current (V
in external power supply going out of regulation. Ensure external V
current. This will be the greatest risk when the MCU is not consuming power. Examples are: if no system clock is present, or if
clock rate is very low (which would reduce overall power consumption).
6
5
4
3
2
1
0
14
12
10
8
6
4
2
0
0
Figure A-1. Typical Low-Side Driver (Sink) Characteristics
Figure A-2. Typical Low-Side Driver (Sink) Characteristics
0
0.2
Low Drive (PTxDSn = 0), V
Low Drive (PTxDSn = 0), V
0.4
Typical Low-side Driver (LDS) Characteristics,
Typical Low-side Driver (LDS) Characteristics,
MC9S08QD4 Series MCU Data Sheet, Rev. 6
In
0.4
> V
0.8
DD
) is greater than I
0.6
V
V
DD
DD
1.2
= 5.0 V, PORTA
V
= 3.0 V, PORTA
V
OL
OL
0.8
DD
/V
/V
range during instantaneous and operating maximum current
1.6
DD
DD
DD
1
DD
, the injection current may flow out of V
= 3.0 V, V
= 5.0V, V
load will shunt current greater than maximum injection
2
1.2
OL
OL
2.4
1.4
vs. I
vs. I
OL
OL
2.8
–1.6
Freescale Semiconductor
85
25
0
125
105
85
25
0
–40
125
105
–40
DD
and could result