MC9S08QD4VSC Freescale Semiconductor, MC9S08QD4VSC Datasheet - Page 186

• Manufacturer Part Number: MC9S08QD4VSC
• Description: IC MCU 4K FLASH 256RAM 8-SOIC
• Manufacturer: Freescale Semiconductor
• Series: HCS08r

Specifications of MC9S08QD4VSC

• Core Processor: HCS08
• Core Size: 8-Bit
• Speed: 10MHz
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 4
• Program Memory Size: 4KB (4K x 8)
• Program Memory Type: FLASH
• Ram Size: 256 x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 4x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 8-SOIC (3.9mm Width)
• Processor Series: S08QD
• Core: HCS08
• Data Bus Width: 8 bit
• Data Ram Size: 256 B
• Interface Type: I2C, SCI, SPI
• Maximum Clock Frequency: 8 MHz
• Number Of Programmable I/os: 4
• Number Of Timers: 3
• Operating Supply Voltage: 2.7 V to 5.5 V
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWS08
• Development Tools By Supplier: DEMO9S08QD4
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 4-ch x 10-bit
• Cpu Family: HCS08
• Device Core Size: 8b
• Frequency (max): 8MHz
• Total Internal Ram Size: 256Byte
• # I/os (max): 4
• Number Of Timers - General Purpose: 3
• Operating Supply Voltage (typ): 3.3/5V
• Operating Supply Voltage (max): 5.5V
• Operating Supply Voltage (min): 2.7V
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 105C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 8
• Package Type: SOIC N
• For Use With: DEMO9S08QD4 - BOARD DEMO FOR MC9S08QD FAMILY
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Connectivity: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Appendix A Electrical Characteristics
A.8
This section describes AC timing characteristics for each peripheral system.
A.8.1
1
2
3
4
5
186
Bus frequency (t
Real-time interrupt internal oscillator period
External reset pulse width
IRQ pulse width
KBIPx pulse width
Port rise and fall time (load = 50 pF)
BKGD/MS setup time after issuing background debug force
reset to enter user or BDM modes
BKGD/MS hold time after issuing background debug force
reset to enter user or BDM modes
Data in Typical column was characterized at 3.0 V, 25°C.
This is the shortest pulse that is guaranteed to be recognized.
This is the minimum pulse width that is guaranteed to pass through the pin synchronization circuitry. Shorter pulses may or
may not be recognized. In stop mode, the synchronizer is bypassed so shorter pulses can be recognized in that case.
Timing is shown with respect to 20% V
To enter BDM mode following a POR, BKGD/MS must be held low during the power-up and for a hold time of t
rises above V
Slew rate control enabled (PTxSE = 1)
Slew rate control disabled (PTxSE = 0)
Asynchronous path
Synchronous path
Asynchronous path
Synchronous path
AC Characteristics
Control Timing
LVD
cyc
.
= 1/f
3
3
2
2
RESET PIN
Bus
Parameter
2
)
5
4
MC9S08QD4 Series MCU Data Sheet, Rev. 6
DD
and 80% V
Figure A-12. Reset Timing
Table A-8. Control Timing
DD
levels. Temperature range –40°C to 125°C.
t
t
t
Symbol
ILIH,
ILIH,
Rise
t
t
MSSU
t
t
f
extrst
t
MSH
extrst
Bus
RTI
, t
t
t
IHIL
IHIL
Fall
1.5 t
1.5 t
Min
700
100
100
100
500
100
—
—
1
cyc
cyc
Typical
30
—
—
—
—
—
—
—
3
1
Freescale Semiconductor
1300
Max
—
—
—
—
—
—
—
8
MSH
after V
MHz
Unit
μs
ns
ns
ns
ns
ns
μs
DD