MC9S08QD4VSC Freescale Semiconductor, MC9S08QD4VSC Datasheet - Page 20

• Manufacturer Part Number: MC9S08QD4VSC
• Description: IC MCU 4K FLASH 256RAM 8-SOIC
• Manufacturer: Freescale Semiconductor
• Series: HCS08r

Specifications of MC9S08QD4VSC

• Core Processor: HCS08
• Core Size: 8-Bit
• Speed: 10MHz
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 4
• Program Memory Size: 4KB (4K x 8)
• Program Memory Type: FLASH
• Ram Size: 256 x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 4x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 8-SOIC (3.9mm Width)
• Processor Series: S08QD
• Core: HCS08
• Data Bus Width: 8 bit
• Data Ram Size: 256 B
• Interface Type: I2C, SCI, SPI
• Maximum Clock Frequency: 8 MHz
• Number Of Programmable I/os: 4
• Number Of Timers: 3
• Operating Supply Voltage: 2.7 V to 5.5 V
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWS08
• Development Tools By Supplier: DEMO9S08QD4
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 4-ch x 10-bit
• Cpu Family: HCS08
• Device Core Size: 8b
• Frequency (max): 8MHz
• Total Internal Ram Size: 256Byte
• # I/os (max): 4
• Number Of Timers - General Purpose: 3
• Operating Supply Voltage (typ): 3.3/5V
• Operating Supply Voltage (max): 5.5V
• Operating Supply Voltage (min): 2.7V
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 105C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 8
• Package Type: SOIC N
• For Use With: DEMO9S08QD4 - BOARD DEMO FOR MC9S08QD FAMILY
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Connectivity: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Chapter 2 External Signal Description
2.2.1
V
I/O buffer circuitry, the ADC module, and to an internal voltage regulator. The internal voltage regulator
provides regulated lower-voltage source to the CPU and other internal circuitry of the MCU.
Typically, application systems have two separate capacitors across the power pins: a bulk electrolytic
capacitor, such as a 10μF tantalum capacitor, to provide bulk charge storage for the overall system, and a
bypass capacitor, such as a 0.1μF ceramic capacitor, located as near to the MCU power pins as practical
to suppress high-frequency noise.
20
DD
V
DD
OPTIONAL
and V
NOTES:
SYSTEM
POWER
MANUAL
RESET
BACKGROUND HEADER
1. RESET pin can only be used to reset into user mode, you can not enter BDM using RESET pin. BDM can
2. IRQ has optional internal pullup/pulldown device
SS
be entered by holding MS low during POR or writing a 1 to BDFR in SBDFR with MS low after issuing BDM
command.
Power
+
5 V
are the primary power supply pins for the MCU. This voltage source supplies power to all
C
ASYNCHRONOUS
10 μF
BLK
NOTE 1
INTERRUPT
INPUT
V
+
DD
0.1 μF
C
BY
MC9S08QD4 Series MCU Data Sheet, Rev. 6
Figure 2-2. Basic System Connections
V
V
DD
NOTE 2
SS
BKGD
RESET
IRQ
MC9S08QD4
PORT
A
PTA0/KBI1P0/TPM1CH0/ADC1P0
PTA1/KBI1P1/TPM1CH1/ADC1P1
PTA2/KBI1P2/TCLK1/ADC1P2
PTA3/KBI1P3/TCLK2/ADC1P3
PTA4/TPM2CH0O/BKGD/MS
PTA5/TPM2CH0I/IRQ/RESET
Freescale Semiconductor
INTERFACE TO
APPLICATION
PERIPHERAL
SYSTEM
I/O AND