MC9S08QD4VSC Freescale Semiconductor, MC9S08QD4VSC Datasheet - Page 36

• Manufacturer Part Number: MC9S08QD4VSC
• Description: IC MCU 4K FLASH 256RAM 8-SOIC
• Manufacturer: Freescale Semiconductor
• Series: HCS08r

Specifications of MC9S08QD4VSC

• Core Processor: HCS08
• Core Size: 8-Bit
• Speed: 10MHz
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 4
• Program Memory Size: 4KB (4K x 8)
• Program Memory Type: FLASH
• Ram Size: 256 x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 4x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 8-SOIC (3.9mm Width)
• Processor Series: S08QD
• Core: HCS08
• Data Bus Width: 8 bit
• Data Ram Size: 256 B
• Interface Type: I2C, SCI, SPI
• Maximum Clock Frequency: 8 MHz
• Number Of Programmable I/os: 4
• Number Of Timers: 3
• Operating Supply Voltage: 2.7 V to 5.5 V
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWS08
• Development Tools By Supplier: DEMO9S08QD4
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 4-ch x 10-bit
• Cpu Family: HCS08
• Device Core Size: 8b
• Frequency (max): 8MHz
• Total Internal Ram Size: 256Byte
• # I/os (max): 4
• Number Of Timers - General Purpose: 3
• Operating Supply Voltage (typ): 3.3/5V
• Operating Supply Voltage (max): 5.5V
• Operating Supply Voltage (min): 2.7V
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 105C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 8
• Package Type: SOIC N
• For Use With: DEMO9S08QD4 - BOARD DEMO FOR MC9S08QD FAMILY
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Connectivity: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

0xFFAA –
0xFFAC
0xFFAD
0xFFAE
0xFFAF
0xFFB0 –
0xFFB7
0xFFB8 –
0xFFBC
0xFFBD
0xFFBE
0xFFBF
Chapter 4 Memory Map and Register Definition
Provided the key enable (KEYEN) bit is 1, the 8-byte comparison key can be used to temporarily
disengage memory security. This key mechanism can be accessed only through user code running in secure
memory. (A security key cannot be entered directly through background debug commands.) This security
key can be disabled completely by programming the KEYEN bit to 0. If the security key is disabled, the
only way to disengage security is by mass erasing the flash if needed (normally through the background
debug interface) and verifying that flash is blank. To avoid returning to secure mode after the next reset,
program the security bits (SEC01:SEC00) to the unsecured state (1:0).
The ICS factory-trimmed value will be stored in 0xFFAE (bit-0) and 0xFFAF. Development tools, such as
programmers can trim the ICS and the internal temperature sensor (via the ADC) and store the values in
0xFFAD–0xFFAF.
4.4
The MC9S08QD4 series includes static RAM. The locations in RAM below 0x0100 can be accessed using
the more efficient direct addressing mode, and any single bit in this area can be accessed with the bit
manipulation instructions (BCLR, BSET, BRCLR, and BRSET). Locating the most frequently accessed
program variables in this area of RAM is preferred.
The RAM retains data when the MCU is in low-power wait, stop2, or stop3 mode. At power-on or after
wakeup from stop1, the contents of RAM are uninitialized. RAM data is unaffected by any reset provided
that the supply voltage does not drop below the minimum value for RAM retention (V
36
Address
Reserved
Reserved for
ADCRL of AD26
value during ICS
trim
Reserved for
ADCRH of AD26
value during ICS
trim and ICS Trim
value “FTRIM”
Reserved for
ICS Trim value
“TRIM”
NVBACKKEY
Reserved
NVPROT
Unused
NVOPT
RAM
Register Name
KEYEN
ADR7
ADR9
Bit 7
—
—
—
—
—
Table 4-4. Nonvolatile Register Summary
MC9S08QD4 Series MCU Data Sheet, Rev. 6
FNORED
ADR6
ADR8
—
—
—
—
—
6
ADR5
—
—
—
—
—
—
5
0
8-Byte Comparison Key
ADR4
FPS
—
—
—
—
—
—
4
0
TRIM
ADR3
—
—
—
—
—
—
3
0
ADR2
—
—
—
—
—
—
2
0
Freescale Semiconductor
RAM
SEC01
ADR1
—
—
—
—
—
—
1
).
SEC00
FTRIM
FPDIS
ADR0
Bit 0
—
—
—
—
—