DF2161BVTE10 Renesas Electronics America, DF2161BVTE10 Datasheet - Page 391

MCU 3V 128K 144-TQFP

DF2161BVTE10

Manufacturer Part Number
DF2161BVTE10
Description
MCU 3V 128K 144-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2100r
Datasheet

Specifications of DF2161BVTE10

Core Processor
H8S/2000
Core Size
16-Bit
Speed
10MHz
Connectivity
Host Interface (LPC), I²C, IrDA, SCI, X-Bus
Peripherals
PWM, WDT
Number Of I /o
114
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
144-TQFP, 144-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Other names
HD64F2161BVTE10
HD64F2161BVTE10
Table 13.7 Examples of TCR, TCSR, TOCR, and OCRDM Settings
Register
TCR in FRT
TCSR in FRT
TOCR in FRT
OCRDM in FRT 7 to 0
IHI signal
(without 2fH
modification)
IHI signal
(with 2fH
modification)
Mask interval
ICRD + OCRDM
ICRD + OCRDM
FRC
ICRD
Bit
4
1 and 0
0
7
2
Figure 13.6 2fH Modification Timing Chart
Abbreviation
IEDGD
CKS1 and CKS0
CCLRA
ICRDMS
OCRDM7 to
OCRDM0
Contents
0
H'01 to H'FF Specifies the period during which
1
01
1
Rev. 3.00 Mar 21, 2006 page 335 of 788
Description
FRC value is transferred to ICRD on
the rising edge of input capture input
D (IHI signal)
FRC is incremented on internal clock:
FRC clearing is disabled
ICRD is set to the operating mode in
which OCRDM is used
ICRD operation is masked
/8
Section 13 Timer Connection
REJ09B0300-0300

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