DF2161BVTE10 Renesas Electronics America, DF2161BVTE10 Datasheet - Page 756

MCU 3V 128K 144-TQFP

DF2161BVTE10

Manufacturer Part Number
DF2161BVTE10
Description
MCU 3V 128K 144-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2100r
Datasheet

Specifications of DF2161BVTE10

Core Processor
H8S/2000
Core Size
16-Bit
Speed
10MHz
Connectivity
Host Interface (LPC), I²C, IrDA, SCI, X-Bus
Peripherals
PWM, WDT
Number Of I /o
114
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
144-TQFP, 144-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Other names
HD64F2161BVTE10
HD64F2161BVTE10
Section 26 List of Registers
Note:
Rev. 3.00 Mar 21, 2006 page 700 of 788
REJ09B0300-0300
H'FFF8
H'FFF9
H'FFFA
H'FFFC
H'FFFD
H'FFFE
H'FFFF
Address
Lower
* Although setting the XBS corresponding bits does not affected to the LPC operation,
the HI12E bit in SYSCR2 must not be set to 1 to use the LPC according to the limitation
depending on the program development tool (emulator) configuration.
DADR0
DADR1
DACR
IDR_2
TCONRI
ODR_2
TCONRO
STR_2
TCONRS
SEDGR
Register
Name
MSTP10 = 0
MSTP2 = 0, HIE = 1 in
SYSCR
MSTP8 = 0, HIE = 0 in
SYSCR
MSTP2 = 0, HIE = 1 in
SYSCR
MSTP8 = 0, HIE = 0 in
SYSCR
MSTP2 = 0, HIE = 1 in
SYSCR
MSTP8 = 0, HIE = 0 in
SYSCR
Register Select Condition
H8S/2140B, H8S/2141B,
H8S/2145B, H8S/2148B
MSTP10 = 0
MSTP2 = 0, HIE = 1 in
SYSCR
MSTP8 = 0, HIE = 0 in
SYSCR
MSTP2 = 0, HIE = 1 in
SYSCR
MSTP8 = 0, HIE = 0 in
SYSCR
MSTP2 = 0, HIE = 1 in
SYSCR
MSTP8 = 0, HIE = 0 in
SYSCR
Register Select Condition
H8S/2160B, H8S/2161B
D/A
XBS
Timer
connection
XBS
Timer
connection
XBS
Timer
connection
Module
Name

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