DF2161BVTE10 Renesas Electronics America, DF2161BVTE10 Datasheet - Page 706
DF2161BVTE10
Manufacturer Part Number
DF2161BVTE10
Description
MCU 3V 128K 144-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2100r
Datasheet
1.DF2160BVT10V.pdf
(847 pages)
Specifications of DF2161BVTE10
Core Processor
H8S/2000
Core Size
16-Bit
Speed
10MHz
Connectivity
Host Interface (LPC), I²C, IrDA, SCI, X-Bus
Peripherals
PWM, WDT
Number Of I /o
114
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
144-TQFP, 144-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Other names
HD64F2161BVTE10
HD64F2161BVTE10
HD64F2161BVTE10
- Current page: 706 of 847
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Section 25 Power-Down Modes
25.4
The CPU makes a transition to sleep mode if the SLEEP instruction is executed when the SSBY
bit in SBYCR is cleared to 0 and the LSON bit in LPWRCR is cleared to 0. In sleep mode, CPU
operation stops but the peripheral modules do not stop. The contents of the CPU’s internal
registers are retained.
Sleep mode is exited by any interrupt, the RES pin, or the STBY pin.
When an interrupt occurs, sleep mode is exited and interrupt exception handling starts. Sleep mode
is not exited if the interrupt is disabled, or interrupts other than NMI are masked by the CPU.
Setting the RES pin level low cancels sleep mode and selects the reset state. After the oscillation
stabilization time has passed, driving the RES pin high causes the CPU to start reset exception
handling.
When the STBY pin level is driven low, sleep mode is cancelled and a transition is made to
hardware standby mode.
Rev. 3.00 Mar 21, 2006 page 650 of 788
REJ09B0300-0300
peripheral module clock
Bus master clock
Internal address bus
Internal write signal
,
Sleep Mode
Figure 25.2 Medium-Speed Mode Timing
SBYCR
Medium-speed mode
SBYCR
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