DF2161BVTE10 Renesas Electronics America, DF2161BVTE10 Datasheet - Page 836

MCU 3V 128K 144-TQFP

DF2161BVTE10

Manufacturer Part Number
DF2161BVTE10
Description
MCU 3V 128K 144-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2100r
Datasheet

Specifications of DF2161BVTE10

Core Processor
H8S/2000
Core Size
16-Bit
Speed
10MHz
Connectivity
Host Interface (LPC), I²C, IrDA, SCI, X-Bus
Peripherals
PWM, WDT
Number Of I /o
114
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
144-TQFP, 144-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Other names
HD64F2161BVTE10
HD64F2161BVTE10
Appendix C Package Dimensions
Rev. 3.00 Mar 21, 2006 page 780 of 788
REJ09B0300-0300
P-QFP100-14x14-0.50
JEITA Package Code
100
76
e
PRQP0100KA-A
75
RENESAS Code
1
Appendix C Package Dimensions
Z
D
Figure C.1 Package Dimensions (FP-100B)
*1
H
D
D
y
FP-100B/FP-100BV
*3
b
Previous Code
p
51
25
50
26
x
F
M
MASS[Typ.]
1.2g
Terminal cross section
Detail F
b
b
1
p
L
1
L
NOTE)
1. DIMENSIONS"*1"AND"*2"
2. DIMENSION"*3"DOES NOT
DO NOT INCLUDE MOLD FLASH
INCLUDE TRIM OFFSET.
Reference
Symbol
e
D
E
A
H
H
A
A
b
b
c
c
x
y
Z
Z
L
L
1
p
1
1
2
1
D
E
D
E
Dimension in Millimeters
15.7
15.7
0.00
0.17
0.12
Min
0.3
Nom
2.70
16.0
16.0
0.12
0.22
0.20
0.17
0.15
14
14
0.5
1.0
1.0
0.5
1.0
16.3
16.3
3.05
0.25
0.27
0.22
0.08
0.10
Max
0.7

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