DF2367VF33V Renesas Electronics America, DF2367VF33V Datasheet - Page 793

• Manufacturer Part Number: DF2367VF33V
• Description: IC H8S/2367 MCU FLASH 128QFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2300r

Specifications of DF2367VF33V

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 33MHz
• Connectivity: I²C, IrDA, SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 84
• Program Memory Size: 384KB (384K x 8)
• Program Memory Type: FLASH
• Ram Size: 24K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 10x10b, D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 128-QFP
• For Use With: YR0K42378FC000BA - KIT EVAL FOR H8S/2378HS0005KCU11H - EMULATOR E10A-USB H8S(X),SH2(A)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

• Flash MAT Select Register (FMATS)
Bit
7
6
5
4
3
2
1
0
Note:
FMATS specifies whether user MAT or user boot MAT is selected.
*
Bit
Name
MS7
MS6
MS5
MS4
MS3
MS2
MS1
MS0
Set to 1 when in user boot mode, otherwise set to 0.
Initial
Value
0/1*
0
0/1*
0
0/1*
0
0/1*
0
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
R/W
Description
MAT Select
These bits are in user-MAT selection state when the
value other than H'AA is written and in user-boot-MAT
selection state when H'AA is written.
The MAT is switched by writing the value in FMATS.
When the MAT is switched, follow section 20.6, Switching
between User MAT and User Boot MAT. (The user boot
MAT cannot be programmed in user programming mode
if user boot MAT is selected by FMATS. The user boot
MAT must be programmed in boot mode or in PROM
mode.)
H'AA: The user boot MAT is selected (in user-MAT
H'00: Initial value when these bits are initiated in a mode
[Programmable condition] These bits are in the execution
Section 20 Flash Memory (0.18-μm F-ZTAT Version)
selection state when the value of these bits are
other than H'AA)
Initial value when these bits are initiated in user
boot mode.
except for user boot mode (in user-MAT selection
state)
state in the on-chip RAM.
Rev.6.00 Mar. 18, 2009 Page 733 of 980
REJ09B0050-0600