UPD70F3714GC-8BS-A Renesas Electronics America, UPD70F3714GC-8BS-A Datasheet - Page 654

• Manufacturer Part Number: UPD70F3714GC-8BS-A
• Description: MCU 32BIT V850ES/LX2 64-LQFP
• Manufacturer: Renesas Electronics America
• Series: V850ES/Ix2r

Specifications of UPD70F3714GC-8BS-A

• Core Processor: RISC
• Core Size: 32-Bit
• Speed: 20MHz
• Connectivity: CSI, UART/USART
• Peripherals: LVD, PWM, WDT
• Number Of I /o: 39
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 6K x 8
• Voltage - Supply (vcc/vdd): 3.5 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: *
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

<R>
μ
μ
652
PD70F3713GC-8BS-A:
PD70F3714GC-8BS-A:
Infrared reflow
Wave soldering
Partial heating
Soldering Method
These products should be soldered and mounted under the following recommended conditions.
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)
Note After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
Remarks 1. Products with -A at the end of the part number are lead-free products.
2. For soldering methods and conditions other than those recommended above, please contact an
NEC Electronics sales representative.
Package peak temperature: 260°C, Time: 60 seconds max. (at 220°C or higher),
Count: 3 times or less, Exposure limit: 3 days
72 hours)
For details, contact an NEC Electronics sales representative.
Pin temperature: 350°C max., Time: 3 seconds max. (per pin row)
CHAPTER 21 RECOMMENDED SOLDERING CONDITIONS
Table 21-1. Surface Mounting Type Soldering Conditions
64-pin plastic LQFP (14 × 14)
64-pin plastic LQFP (14 × 14)
User’s Manual U17716EJ2V0UD
Soldering Conditions
Note
(after that, prebake at 125°C for 20 to
Recommended
IR60-203-3
Condition
Symbol
–
–