MC9S12XD256VAG Freescale Semiconductor, MC9S12XD256VAG Datasheet - Page 480

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MC9S12XD256VAG

Manufacturer Part Number
MC9S12XD256VAG
Description
IC MCU 256K FLASH 144-LQFP
Manufacturer
Freescale Semiconductor
Series
HCS12r
Datasheet

Specifications of MC9S12XD256VAG

Core Processor
HCS12X
Core Size
16-Bit
Speed
80MHz
Connectivity
CAN, EBI/EMI, I²C, IrDA, LIN, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
119
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Eeprom Size
4K x 8
Ram Size
14K x 8
Voltage - Supply (vcc/vdd)
2.35 V ~ 5.5 V
Data Converters
A/D 24x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 105°C
Package / Case
144-LQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

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Chapter 11 Serial Communication Interface (S12SCIV5)
11.2
The SCI module has a total of two external pins.
11.2.1
The TXD pin transmits SCI (standard or infrared) data. It will idle high in either mode and is high
impedance anytime the transmitter is disabled.
11.2.2
The RXD pin receives SCI (standard or infrared) data. An idle line is detected as a line high. This input is
ignored when the receiver is disabled and should be terminated to a known voltage.
11.3
This section provides a detailed description of all the SCI registers.
11.3.1
The memory map for the SCI module is given below in
the address offset. The total address for each register is the sum of the base address for the SCI module and
the address offset for each register.
480
External Signal Description
Memory Map and Register Definition
TXD — Transmit Pin
RXD — Receive Pin
Module Memory Map and Register Definition
MC9S12XDP512 Data Sheet, Rev. 2.21
Figure
11-2. The address listed for each register is
Freescale Semiconductor

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