MC9S12XD256VAG Freescale Semiconductor, MC9S12XD256VAG Datasheet - Page 847

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MC9S12XD256VAG

Manufacturer Part Number
MC9S12XD256VAG
Description
IC MCU 256K FLASH 144-LQFP
Manufacturer
Freescale Semiconductor
Series
HCS12r
Datasheet

Specifications of MC9S12XD256VAG

Core Processor
HCS12X
Core Size
16-Bit
Speed
80MHz
Connectivity
CAN, EBI/EMI, I²C, IrDA, LIN, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
119
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Eeprom Size
4K x 8
Ram Size
14K x 8
Voltage - Supply (vcc/vdd)
2.35 V ~ 5.5 V
Data Converters
A/D 24x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 105°C
Package / Case
144-LQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

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Freescale Semiconductor
PTM[3:2]
PTM[1:0]
Field
3–2
1–0
The CAN1 function (TXCAN1 and RXCAN1) takes precedence over the routed CAN0, the routed SPI0 and the
general purpose I/O function if the CAN1 module is enabled.
The routed CAN0 function (TXCAN0 and RXCAN0) takes precedence over the routed SPI0 and the general
purpose I/O function if the routed CAN0 module is enabled. Refer to MSCAN section for details.
The routed SPI0 function (SS0 and MISO0) takes precedence of the general purpose I/O function if the routed
SPI0 is enabled and not in bidirectional mode. Refer to SPI section for details.
The CAN0 function (TXCAN0 and RXCAN0) takes precedence over the general purpose I/O function if the CAN0
module is enabled. Refer to MSCAN section for details.
Table 22-32. PTM Field Descriptions (continued)
MC9S12XDP512 Data Sheet, Rev. 2.21
Description
Chapter 22 DP512 Port Integration Module (S12XDP512PIMV2)
849

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