MC9S12XD256VAG Freescale Semiconductor, MC9S12XD256VAG Datasheet - Page 651

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MC9S12XD256VAG

Manufacturer Part Number
MC9S12XD256VAG
Description
IC MCU 256K FLASH 144-LQFP
Manufacturer
Freescale Semiconductor
Series
HCS12r
Datasheet

Specifications of MC9S12XD256VAG

Core Processor
HCS12X
Core Size
16-Bit
Speed
80MHz
Connectivity
CAN, EBI/EMI, I²C, IrDA, LIN, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
119
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Eeprom Size
4K x 8
Ram Size
14K x 8
Voltage - Supply (vcc/vdd)
2.35 V ~ 5.5 V
Data Converters
A/D 24x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 105°C
Package / Case
144-LQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

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Chapter 18
Memory Mapping Control (S12XMMCV3)
18.1
Introduction
This section describes the functionality of the module mapping control (MMC) sub-block of the S12X
platform. The block diagram of the MMC is shown in
Figure
18-1.
The MMC module controls the multi-master priority accesses, the selection of internal resources and
external space. Internal buses, including internal memories and peripherals, are controlled in this module.
The local address space for each master is translated to a global memory space.
MC9S12XDP512 Data Sheet, Rev. 2.21
Freescale Semiconductor
651

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