WG82574L S LBA9 Intel, WG82574L S LBA9 Datasheet - Page 471
WG82574L S LBA9
Manufacturer Part Number
WG82574L S LBA9
Description
CONTROLLER, ENET, INTEL 82574L, 64PQFN
Manufacturer
Intel
Datasheet
1.WG82574IT_S_LBAC.pdf
(490 pages)
Specifications of WG82574L S LBA9
Ethernet Type
IEEE 802.3, IEEE 802.3u, IEEE 802.3ab
Supply Voltage Range
3V To 3.6V
Operating Temperature Range
0°C To +85°C
Digital Ic Case Style
QFN
No. Of Pins
64
Package / Case
QFN
Interface Type
I2C, JTAG, PCI, SPI
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
- Current page: 471 of 490
- Download datasheet (7Mb)
Thermal Design Considerations—82574 GbE Controller
14.5
14.6
Table 94.
Technology trends continue to push these parameters toward increased performance
levels (higher operating speeds), I/O density (smaller packages), and silicon density
(more transistors). Power density increases and thermal cooling solution space and
airflow become more constrained as operating frequencies increase and packaging
sizes decrease. These issues result in an increased emphasis on the following:
Packaging Terminology
The following is a list of packaging terminology used in this section:
Product Package Thermal Specification
Package Thermal Characteristics in Standard JEDEC Environment
• The component die temperature depends on the following:
• Package and thermal enhancement technology to remove heat from the device.
• System design to reduce local ambient temperatures and ensure that thermal
• Quad Flat No Leads - Plastic encapsulated package with a copper leadframe
• Junction - Refers to a P-N junction on the silicon. In this section, it is used as a
• Ambient - Refers to local ambient temperature of the bulk air approaching the
• Lands - The pads on the PCB that the BGA balls are soldered to.
• PCB - Printed Circuit Board.
• Printed Circuit Assembly (PCA) - An assembled PCB.
• Thermal Design Power (TDP) - The estimated maximum possible/expected power
• LFM - Linear Feet per Minute (airflow)
design requirements are met for each component in the system.
substrate. Package uses perimeter lands on the bottom of the package to provide
electrical contact to the PCB. This package is also known as QFN.
temperature reference point (for example, Theta JA refers to the junction to
ambient temperature).
component. It can be measured by placing a thermocouple approximately one inch
upstream from the component edge.
generated in a component by a realistic application. Use the maximum power
requirement numbers from
— Component power dissipation
— Size
— Packaging materials (effective thermal conductivity)
— Type of interconnection to the substrate and motherboard
— Presence of a thermal cooling solution
— Thermal conductivity
— Power density of the substrate/package, nearby components, and circuit board
that is attached to it
Package Type
9 mm-64 QFN
Est. Power
473 mW
(TDP)
Table
94.
39.5
JA
°
C/W
0.7
°
JT
C/W
TJ Max
120
°
C
471
Related parts for WG82574L S LBA9
Image
Part Number
Description
Manufacturer
Datasheet
Request
R
Part Number:
Description:
Manufacturer:
Intel
Datasheet:
Part Number:
Description:
Microprocessor: Intel Celeron M Processor 320 and Ultra Low Voltage Intel Celeron M Processor at 600MHz
Manufacturer:
Intel Corporation
Part Number:
Description:
Intel 82550 Fast Ethernet Multifunction PCI/CardBus Controller
Manufacturer:
Intel Corporation
Datasheet:
Part Number:
Description:
Intel StrataFlash memory 32 Mbit. Access speed 120 ns
Manufacturer:
Intel Corporation
Datasheet:
Part Number:
Description:
Intel StrataFlash memory 32 Mbit. Access speed 120 ns
Manufacturer:
Intel Corporation
Datasheet:
Part Number:
Description:
Intel StrataFlash memory 64 Mbit. Access speed 150 ns
Manufacturer:
Intel Corporation
Datasheet:
Part Number:
Description:
Intel StrataFlash memory 32 Mbit. Access speed 100 ns
Manufacturer:
Intel Corporation
Datasheet:
Part Number:
Description:
DA28F640J5A-1505 Volt Intel StrataFlash Memory
Manufacturer:
Intel Corporation
Datasheet:
Part Number:
Description:
5 Volt Intel StrataFlash?? Memory
Manufacturer:
Intel Corporation
Datasheet:
Part Number:
Description:
5 Volt Intel StrataFlash?? Memory
Manufacturer:
Intel Corporation
Part Number:
Description:
Intel 6300ESB I/O Controller Hub
Manufacturer:
Intel Corporation
Datasheet:
Part Number:
Description:
Intel 82801DB I/O Controller Hub (ICH4), Pb-Free SLI
Manufacturer:
Intel Corporation
Datasheet:
Part Number:
Description:
Intel 82801FB I/O Controller Hub (ICH6)
Manufacturer:
Intel Corporation
Datasheet: