mt47h128m16hg-3-it Micron Semiconductor Products, mt47h128m16hg-3-it Datasheet - Page 126

• Manufacturer Part Number: mt47h128m16hg-3-it
• Description: 2gb X4, X8, X16 Ddr2 Sdram
• Manufacturer: Micron Semiconductor Products

Package Dimensions
Figure 90:
PDF: 09005aef824f87b6/Source: 09005aef824f1182
2gb_ddr2.fm - Rev. A 9/06 EN
SEATING
DIMENSIONS
APPLY TO SOLDER
BALLS POST
REFLOW. THE PRE-
REFLOW DIAMETER
IS 0.42 ON A 0.33
NSMD BALL
PAD.
11.20
PLANE
0.10
84X Ø0.45
5.60
A
84-Ball FBGA Package – 11.5mm x 14mm (x16)
A
Note:
3.20
11.50 ±0.10
1.80 ±0.05
All dimensions are in millimeters.
BALL A9
CTR
6.40
0.80
TYP
C L
5.75 ±0.05
BALL A1
7.00 ±0.05
C L
0.80 TYP
BALL A1 ID
0.80 ±0.05
126
14.00 ±0.10
0.155 ±0.013
Micron Technology, Inc., reserves the right to change products or specifications without notice.
0.300 ±0.025
2Gb: x4, x8, x16 DDR2 SDRAM
SOLDER BALL MATERIAL:
SUBSTRATE MATERIAL:
MOLD COMPOUND:
1.20 MAX
96.5% Sn, 3% Ag, 0.5% Cu
PLASTIC LAMINATE
EPOXY NOVALAC
BALL A1 ID
Package Dimensions
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