mt47h128m16hg-3-it Micron Semiconductor Products, mt47h128m16hg-3-it Datasheet - Page 127

• Manufacturer Part Number: mt47h128m16hg-3-it
• Description: 2gb X4, X8, X16 Ddr2 Sdram
• Manufacturer: Micron Semiconductor Products

Figure 91:
PDF: 09005aef824f87b6/Source: 09005aef824f1182
2gb_ddr2.fm - Rev. A 9/06 EN
Micron, the M logo, and the Micron logo are trademarks of Micron Technology, Inc. All other trademarks are the property of
This data sheet contains minimum and maximum limits specified over the complete power supply and temperature range
SOLDER BALL
DIAMETER REFERS
TO POST-REFLOW
CONDITION.
SEATING
60X Ø0.45
PLANE
8.00
for production devices. Although considered final, these specifications are subject to change, as further product
0.10 A
BALL A9
4.00
60-Ball FBGA Package – 11.5mm x 14mm (x4/x8)
A
[e-mail] www.micron.com Customer Comment Line: 800-932-4992
Note:
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: [phone]
3.20
1.80 ±0.05 CTR
11.50 ±0.10
All dimensions are in millimeters.
development and data characterization sometimes occur.
0.80
6.40
TYP
C L
5.75 ±0.05
their respective owners.
0.80 TYP
7.00 ±0.05
C L
BALL A1 ID
BALL A1
0.80 ±0.05
127
0.17 MAX
14.00 ±0.10
®
Micron Technology, Inc., reserves the right to change products or specifications without notice.
1.20 MAX
2Gb: x4, x8, x16 DDR2 SDRAM
SOLDER BALL MATERIAL:
NON SOLDER MASK DEFINED
SUBSTRATE MATERIAL:
MOLD COMPOUND:
96.5% Sn, 3% Ag, 0.5% Cu
SOLDER BALL PAD: Ø0.33
PLASTIC LAMINATE
EPOXY NOVALAC
Package Dimensions
©2006 Micron Technology, Inc. All rights reserved.
BALL A1 ID