lrs1383 Sharp Microelectronics of the Americas, lrs1383 Datasheet - Page 102

• Manufacturer Part Number: lrs1383
• Description: Stacked Chip 32m Flash And 8m Sram
• Manufacturer: Sharp Microelectronics of the Americas

PCR.15-11 = RESERVED FOR FUTURE
PCR.10-8 = PARTITION CONFIGURATION (PC2-0)
• 000 = No partitioning. Dual Work is not allowed.
• 001 = Plane1-3 are merged into one partition.
• 010 = Plane 0-1 and Plane2-3 are merged into one
• 100 = Plane 0-2 are merged into one partition.
• 011 = Plane 2-3 are merged into one partition. There are
• 110 = Plane 0-1 are merged into one partition. There are
• 101 = Plane 1-2 are merged into one partition. There are
(default in a bottom parameter device)
partition respectively.
(default in a top parameter device)
three partitions in this configuration. Dual work operation
is available between any two partitions.
three partitions in this configuration. Dual work operation
is available between any two partitions.
three partitions in this configuration. Dual work operation
is available between any two partitions.
15
R
R
7
ENHANCEMENTS (R)
14
R
R
6
Appendix to Spec No.: MFM2-J13207
Table 17. Partition Configuration Register Definition
13
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5
Figure 17. Partition Configuration
12
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R
4
FUM00701
PCR.7-0 = RESERVED FOR FUTURE
1. After power-up or device reset, PCR10-8 (PC2-0) is set to
2. See Figure 17 for the detail on partition configuration.
3. PCR.15-11 and PCR.7-0 bits are reserved for future use.
Model No.: LRS1383
• 111 = There are four partitions in this configuration.
"001" in a bottom parameter device and "100" in a top
parameter device.
If these bits are read via the Read Identifier Codes/OTP
command, the device may output "1" or "0" on these bits.
Each plane corresponds to each partition respectively.
Dual work operation is available between any two
partitions.
11
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3
ENHANCEMENTS (R)
March 1, 2001
PC2
10
R
2
NOTES:
PC1
R
9
1
Rev. 2.20
PC0
R
8
0
56