ADSP-21362WBBCZ-1A AD [Analog Devices], ADSP-21362WBBCZ-1A Datasheet - Page 51

• Manufacturer Part Number: ADSP-21362WBBCZ-1A
• Description: SHARC Processor
• Manufacturer: AD [Analog Devices]

OUTLINE DIMENSIONS
The ADSP-2136x is available in a 136-ball BGA package.
SURFACE MOUNT DESIGN
Table 44
standard design recommendations, refer to IPC-7351, Generic
Requirements for Surface Mount Design and Land Pattern
Standard.
Table 44. BGA Data for Use with Surface Mount Design
Package
136-Ball Grid Array (BC-136-2)
is provided as an aide to PCB design. For industry-
MAX
1.70
1. DIMENSIONS ARE IN MILIMETERS (MM).
2. THE ACTUAL POSITION OF THE BALL GRID IS
3. COMPLIANT TO JEDEC STANDARD MO-205-AE, EXCEPT FOR
4. CENTER DIMENSIONS ARE NOMINAL.
WITHIN 0.15 MM OF ITS IDEAL POSITION RELATIVE
TO THE PACKAGE EDGES.
THE BALL DIAMETER.
ADSP-21362/ADSP-21363/ADSP-21364/ADSP-21365/ADSP-21366
PIN A1 INDICATOR
Figure 45. 136-Ball Chip Scale Package Ball Grid Array [CSP_BGA](BC-136-2)
12.00 BSC SQ
TOP VIEW
Ball Attach Type
Solder Mask Defined
Rev. A | Page 51 of 52 | December 2006
DETAIL A
BSC
BSC
0.80
0.80
TYP
TYP
0.25
MIN
G
M
A
B
C
D
E
H
K
N
P
F
J
L
14
DIAMETER)
13
Solder Mask Opening
0.40 mm diameter
(BALL
12
0.45
0.50
0.40
11
10 9 8 7 6 5 4 3 2 1
BOTTOM VIEW
10.40 BSC SQ
DETAIL A
0.12 MAX (BALL
COPLANARITY)
SEATING
PLANE
Ball Pad Size
0.53 mm diameter
BSC
0.80
TYP