dsPIC33FJ32GP104-I/PT Microchip Technology, dsPIC33FJ32GP104-I/PT Datasheet - Page 280

• Manufacturer Part Number: dsPIC33FJ32GP104-I/PT
• Description: Digital Signal Processors & Controllers - DSP, DSC 16bit Gen Prp Fam16 MIPS 32KBFLSH 2KBRAM
• Manufacturer: Microchip Technology
• Type: dsPIC33FJ32(GP/MC)101/102/104r

Specifications of dsPIC33FJ32GP104-I/PT

• Rohs: yes
• Core: dsPIC33F
• Data Bus Width: 16 bit
• Program Memory Size: 32 KB
• Data Ram Size: 2 KB
• Maximum Clock Frequency: 7.37 MHz, 32 kHz
• Number Of Programmable I/os: 35
• Number Of Timers: 5 x 16-bit, 2 x 32-bit
• Device Million Instructions Per Second: 16 MIPs
• Operating Supply Voltage: 3 V to 3.6 V
• Maximum Operating Temperature: + 125 C
• Package / Case: TQFP-44
• Mounting Style: SMD/SMT
• Family / Core: dsPIC33FJ32(GP/MC)101/102/104
• Interface Type: I2C, SPI, UART
• Minimum Operating Temperature: - 40 C
• On-chip Adc: Yes
• Product: DSPs
• Program Memory Type: Flash
• Supply Current: 10 mA

dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
26.1
TABLE 26-1:
TABLE 26-2:
TABLE 26-3:
DS70652E-page 280
DC5
Note 1:
Industrial Temperature Devices
Extended Temperature Devices
Power Dissipation:
Internal Chip Power Dissipation:
I/O Pin Power Dissipation:
Maximum Allowed Power Dissipation
Package Thermal Resistance, 18-pin PDIP
Package Thermal Resistance, 20-pin PDIP
Package Thermal Resistance, 28-pin SPDIP
Package Thermal Resistance, 18-pin SOIC
Package Thermal Resistance, 20-pin SOIC
Package Thermal Resistance, 28-pin SOIC
Package Thermal Resistance, 20-pin SSOP
Package Thermal Resistance, 28-pin SSOP
Package Thermal Resistance, 28-pin QFN (6x6 mm)
Package Thermal Resistance, 36-pin VTLA (5x5 mm)
Package Thermal Resistance, 44-pin TQFP
Package Thermal Resistance, 44-pin QFN
Package Thermal Resistance, 44-pin VTLA
Note 1:
Characteristic
2:
DC Characteristics
P
I/O =  ({V
Operating Junction Temperature Range
Operating Ambient Temperature Range
Operating Junction Temperature Range
Operating Ambient Temperature Range
INT
Overall functional device operation at V
analog modules, such as the ADC, etc., will function but with degraded performance below V
Junction to ambient thermal resistance; Theta-
This package is available in dsPIC33FJ32(GP/MC)104 devices only.
= V
DD
OPERATING MIPS vs. VOLTAGE
THERMAL OPERATING CONDITIONS
THERMAL PACKAGING CHARACTERISTICS
DD
x (I
V
V
– V
V
DD
BOR
BOR
(in Volts)
DD
OH
Characteristic
–  I
Range
-3.6V
-3.6V
} x I
Rating
OH
OH
(1)
(1)
)
) +  (V
OL
x I
OL
-40°C to +125°C
)
BOR
-40°C to +85°C
Temp Range
(in °C)
< V
JA
DD
(
< V
JA
) numbers are achieved by package simulations.
DDMIN
Symbol
Symbol
P
DMAX













P
T
T
T
T
is ensured but not characterized. All device
JA
JA
JA
JA
JA
JA
JA
JA
JA
JA
JA
JA
JA
A
A
D
J
J
dsPIC33FJ16(GP/MC)101/102 and
dsPIC33FJ32(GP/MC)101/102/104
31.1
Min
Typ
-40
-40
-40
-40
50
50
50
63
63
55
90
71
37
45
32
30
 2011-2012 Microchip Technology Inc.
(T
P
J
INT
– T
Max
Typ
Max MIPS
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
+ PIO
A
)/
16
16
JA
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
+125
+140
+125
Max
Unit
+85
DDMIN
Notes
.
Unit
1,
1,
1,
°C
°C
°C
°C
W
W
1
1
1
1
1
1
1
1
1
1
2
2
2