dsPIC33FJ32GP104-I/PT Microchip Technology, dsPIC33FJ32GP104-I/PT Datasheet - Page 35

• Manufacturer Part Number: dsPIC33FJ32GP104-I/PT
• Description: Digital Signal Processors & Controllers - DSP, DSC 16bit Gen Prp Fam16 MIPS 32KBFLSH 2KBRAM
• Manufacturer: Microchip Technology
• Type: dsPIC33FJ32(GP/MC)101/102/104r

Specifications of dsPIC33FJ32GP104-I/PT

• Rohs: yes
• Core: dsPIC33F
• Data Bus Width: 16 bit
• Program Memory Size: 32 KB
• Data Ram Size: 2 KB
• Maximum Clock Frequency: 7.37 MHz, 32 kHz
• Number Of Programmable I/os: 35
• Number Of Timers: 5 x 16-bit, 2 x 32-bit
• Device Million Instructions Per Second: 16 MIPs
• Operating Supply Voltage: 3 V to 3.6 V
• Maximum Operating Temperature: + 125 C
• Package / Case: TQFP-44
• Mounting Style: SMD/SMT
• Family / Core: dsPIC33FJ32(GP/MC)101/102/104
• Interface Type: I2C, SPI, UART
• Minimum Operating Temperature: - 40 C
• On-chip Adc: Yes
• Product: DSPs
• Program Memory Type: Flash
• Supply Current: 10 mA

2.5
The PGECx and PGEDx pins are used for In-Circuit
Serial Programming™ (ICSP™) and debugging pur-
poses. It is recommended to keep the trace length
between the ICSP connector and the ICSP pins on the
device as short as possible. If the ICSP connector is
expected to experience an ESD event, a series resistor
is recommended, with the value in the range of a few
tens of Ohms, not to exceed 100 Ohms.
Pull-up resistors, series diodes, and capacitors on the
PGECx and PGEDx pins are not recommended as they
will interfere with the programmer/debugger communi-
cations to the device. If such discrete components are
an application requirement, they should be removed
from the circuit during programming and debugging.
Alternately, refer to the AC/DC characteristics and
timing requirements information in the “dsPIC33F
Flash Programming Specification for Devices with Vol-
atile Configuration Bits” (DS70659) for information on
capacitive loading limits and pin Input Voltage High
(V
Ensure that the “Communication Channel Select” (i.e.,
PGECx/PGEDx pins) programmed into the device
matches the physical connections for the ICSP to
MPLAB
For more information on ICD 3 and REAL ICE
connection requirements, refer to the following
documents that are available on the Microchip web
site.
• “Using MPLAB
• “MPLAB
• “MPLAB
• “Using MPLAB
 2011-2012 Microchip Technology Inc.
IH
User’s Guide” (DS51616)
) and Input Voltage Low (V
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
®
ICSP Pins
ICD 3 or MPLAB REAL ICE™.
®
®
ICD 3 Design Advisory” (DS51764)
REAL ICE™ In-Circuit Debugger
®
®
ICD 3” (poster) (DS51765)
REAL ICE™” (poster) (DS51749)
IL
) requirements.
2.6
Many DSCs have options for at least two oscillators: a
high-frequency primary oscillator and a low-frequency
secondary oscillator (refer to
Configuration”
The oscillator circuit should be placed on the same
side of the board as the device. Also, place the
oscillator circuit close to the respective oscillator pins,
not exceeding one-half inch (12 mm) distance
between them. The load capacitors should be placed
next to the oscillator itself, on the same side of the
board. Use a grounded copper pour around the
oscillator circuit to isolate them from surrounding
circuits. The grounded copper pour should be routed
directly to the MCU ground. Do not run any signal
traces or power traces inside the ground pour. Also, if
using a two-sided board, avoid any traces on the
other side of the board where the crystal is placed. A
suggested layout is shown in
FIGURE 2-3:
Main Oscillator
Guard Ring
Guard Trace
Secondary
Oscillator
External Oscillator Pins
for details).
SUGGESTED PLACEMENT
OF THE OSCILLATOR
CIRCUIT
Figure
Section 8.0 “Oscillator
DS70652E-page 35
2-3.
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