dsPIC33FJ32GP104-I/PT Microchip Technology, dsPIC33FJ32GP104-I/PT Datasheet - Page 286

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dsPIC33FJ32GP104-I/PT

Manufacturer Part Number
dsPIC33FJ32GP104-I/PT
Description
Digital Signal Processors & Controllers - DSP, DSC 16bit Gen Prp Fam16 MIPS 32KBFLSH 2KBRAM
Manufacturer
Microchip Technology
Type
dsPIC33FJ32(GP/MC)101/102/104r
Datasheet

Specifications of dsPIC33FJ32GP104-I/PT

Rohs
yes
Core
dsPIC33F
Data Bus Width
16 bit
Program Memory Size
32 KB
Data Ram Size
2 KB
Maximum Clock Frequency
7.37 MHz, 32 kHz
Number Of Programmable I/os
35
Number Of Timers
5 x 16-bit, 2 x 32-bit
Device Million Instructions Per Second
16 MIPs
Operating Supply Voltage
3 V to 3.6 V
Maximum Operating Temperature
+ 125 C
Package / Case
TQFP-44
Mounting Style
SMD/SMT
Family / Core
dsPIC33FJ32(GP/MC)101/102/104
Interface Type
I2C, SPI, UART
Minimum Operating Temperature
- 40 C
On-chip Adc
Yes
Product
DSPs
Program Memory Type
Flash
Supply Current
10 mA

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DSPIC33FJ32GP104-I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
dsPIC33FJ16(GP/MC)101/102 AND dsPIC33FJ32(GP/MC)101/102/104
TABLE 26-8:
DS70652E-page 286
Power-Down Current (I
DC60d
DC60a
DC60b
DC60c
DC61d
DC61a
DC61b
DC61c
Power-Down Current (I
DC60d
DC60a
DC60b
DC60c
DC61d
DC61a
DC61b
DC61c
Note 1:
DC CHARACTERISTICS
Parameter
No.
2:
3:
4:
5:
Data in the Typical column is at 3.3V, +25°C unless otherwise stated.
I
• CPU core is off, oscillator is configured in EC mode, OSC1 is driven with external square wave from
• CLKO is configured as an I/O input pin in the Configuration Word
• External Secondary Oscillator (SOSC) is disabled (i.e., SOSCO and SOSCI pins are configured as
• All I/O pins are configured as inputs and pulled to V
• MCLR = V
• All peripheral modules are disabled (PMDx bits are all ones)
• VREGS bit (RCON<8>) = 1 (i.e., core regulator is set to stand-by while the device is in Sleep mode)
• On applicable devices, RTCC is disabled, plus the VREGS bit (RCON<8>) = 1
The  current is the additional current consumed when the module is enabled. This current should be
added to the base I
These currents are measured on the device containing the most memory in this family.
These parameters are characterized, but not tested in manufacturing.
PD
rail-to-rail
digital I/O inputs)
(Sleep) current is measured as follows:
Typical
DC CHARACTERISTICS: POWER-DOWN CURRENT (I
150
420
420
530
620
150
420
420
530
620
27
32
43
27
32
43
(1)
DD
PD
PD
, WDT and FSCM are disabled
)
)
(2)
(2)
PD
– dsPIC33FJ16(GP/MC)10X Devices
– dsPIC33FJ32(GP/MC)10X Devices
Max
250
250
250
500
600
600
750
900
250
250
250
500
600
600
750
900
current.
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature
Units
µA
µA
µA
µA
µA
µA
µA
µA
µA
µA
µA
µA
µA
µA
µA
µA
+125°C
+125°C
+125°C
+125°C
+25°C
+85°C
+25°C
+85°C
+25°C
+85°C
+25°C
+85°C
-40°C
-40°C
-40°C
-40°C
SS
-40°C  T
-40°C  T
3.3V
3.3V
3.3V
3.3V
A
A
 +85°C for Industrial
 +125°C for Extended
Conditions
Base Power-Down Current
Watchdog Timer Current: I
Base Power-Down Current
Watchdog Timer Current: I
PD
 2011-2012 Microchip Technology Inc.
)
(3,4)
(3,4)
WDT
WDT
(3,5)
(3,5)

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