PIC18F27J13-I/SP Microchip Technology, PIC18F27J13-I/SP Datasheet - Page 424

• Manufacturer Part Number: PIC18F27J13-I/SP
• Description: IC PIC MCU 128KB FLASH 28SPDIP
• Manufacturer: Microchip Technology
• Series: PIC® XLP™ 18Fr

Specifications of PIC18F27J13-I/SP

• Core Size: 8-Bit
• Program Memory Size: 128KB (64K x 16)
• Core Processor: PIC
• Speed: 48MHz
• Connectivity: I²C, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Number Of I /o: 22
• Program Memory Type: FLASH
• Ram Size: 3.8K x 8
• Voltage - Supply (vcc/vdd): 2.15 V ~ 3.6 V
• Data Converters: A/D 10x10b/12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: *
• Controller Family/series: PIC18
• Cpu Speed: 48MHz
• Digital Ic Case Style: DIP
• Supply Voltage Range: 1.8V To 5.5V
• Embedded Interface Type: I2C, SPI, USART
• Rohs Compliant: Yes
• Core: PIC
• Processor Series: PIC18F
• Data Bus Width: 8 bit
• Maximum Clock Frequency: 48 MHz
• Data Ram Size: 3.76 KB
• On-chip Adc: Yes
• Number Of Programmable I/os: 2
• Number Of Timers: 8
• Operating Supply Voltage: 2.15 V to 3.6 V
• Operating Temperature Range: - 40 C to + 85 C
• A/d Bit Size: 12 bit
• A/d Channels Available: 10
• Height: 3.43 mm
• Interface Type: I2C, SPI, USART
• Length: 34.4 mm
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Supply Voltage (max): 3.6 V
• Supply Voltage (min): 2.15 V
• Width: 7.24 mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: MA180030 - BOARD DEMO PIC18F47J13 FS USBMA180029 - BOARD DEMO PIC18F47J53 FS USB
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

PIC18(L)F2X/4XK22
27.2
DS41412D-page 424
Power-down Base Current (IPD)
D006
Power-down Module Differential Current (delta IPD)
D007
D008
D009
D010
Note 1:
Param
PIC18LF2X/4XK22
PIC18F2X/4XK22
No.
2:
3:
DC Characteristics: Power-Down Current, PIC18(L)F2X/4XK22
Sleep mode
Watchdog Timer
Brown-out Reset
Brown-out Reset
High/Low Voltage Detect
Device Characteristics
The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is
measured with the part in Sleep mode, with all I/O pins in high-impedance state and tied to V
and all features that add delta current disabled (such as WDT, Timer1 Oscillator, BOR, etc.).
BOR, HLVD and FVR enable internal band gap reference. With both modules enabled, current consump-
tion will be less than the sum of both specifications.
A/D converter differential currents apply only in Run mode. In Sleep or Idle mode both the ADC and the
FRC turn off as soon as conversion (if any) is complete.
(2)
(2)
(1)
(2)
Standard Operating Conditions (unless otherwise stated)
Operating temperature
Standard Operating Conditions (unless otherwise stated)
Operating temperature
+25°C
TBD
TBD
TBD
TBD
TBD
0.02
0.02
Typ
0.3
0.5
0.3
0.5
0.5
0.0
0.0
10
11
12
10
12
25
30
65
+60°C
Typ
Preliminary
+85°C
TBD
TBD
TBD
TBD
TBD
Max
2.5
2.5
2.5
2.5
2.5
0.0
0.0
25
25
25
20
20
40
50
90
2
2
+125°C
-40°C  T
-40°C  T
TBD
TBD
TBD
TBD
TBD
Max
2.5
2.5
2.5
2.5
2.5
0.0
0.0
10
10
35
35
35
20
20
40
50
90
A
A
Units
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
A
 +125°C
 +125°C
1.8V-
1.8V-
1.8V
3.0V
1.8V
1.8V
1.8V
3.0V
5.0V
2.0V
3.0V
2.0V
3.0V
5.0V
3.6V
5.5V
2.0V
3.0V
2.0V
3.0V
5.0V
3.0V
5.0V
3.0V
V
DD
 2010 Microchip Technology Inc.
WDT, BOR, FVR and
SOSC disabled, all Periph-
erals inactive
Sleep mode,
BOREN<1:0> = 10
Conditions
Notes
DD
or V
SS