LPC3230FET296,551 NXP Semiconductors, LPC3230FET296,551 Datasheet - Page 4

• Manufacturer Part Number: LPC3230FET296,551
• Description: IC ARM9 MCU 256K 296-TFBGA
• Manufacturer: NXP Semiconductors
• Series: LPC32x0r

Specifications of LPC3230FET296,551

• Core Processor: ARM9
• Core Size: 16/32-Bit
• Speed: 266MHz
• Connectivity: EBI/EMI, I²C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
• Peripherals: DMA, I²S, LCD, Motor Control PWM, PWM, WDT
• Number Of I /o: 51
• Program Memory Type: ROMless
• Ram Size: 256K x 8
• Voltage - Supply (vcc/vdd): 0.9 V ~ 3.6 V
• Data Converters: A/D 3x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 296-TFBGA
• Processor Series: LPC32
• Core: ARM926EJ-S
• Data Bus Width: 32 bit
• Data Ram Size: 256 KB
• Interface Type: I2C, I2S, UART, USB
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 51
• Number Of Timers: 6
• Operating Supply Voltage: 2.7 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 8 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -
• Lead Free Status / Rohs Status: Details
• Other names: 568-4531; 935287119551

NXP Semiconductors
4. Ordering information
Table 1.
[1]
[2]
[3]
Table 2.
LPC3220_30_40_50_1
Product data sheet
Type number
LPC3220FET296
LPC3230FET296
LPC3240FET296
LPC3250FET296
LPC3220FET296/01
LPC3230FET296/01
LPC3240FET296/01
LPC3250FET296/01
Type number
LPC3220FET296
LPC3230FET296
LPC3240FET296
LPC3250FET296
LPC3220FET296/01
LPC3230FET296/01
LPC3240FET296/01
LPC3250FET296/01
F = −40 °C to +85 °C temperature range. Note that Revision “A” parts with and without the /01 suffix are identical. For example,
LPC3220FET296 Revision “A” is identical to LPC3220FET296/01 Revision “A”.
Available in Revision “-” and “A”.
Available starting with Revision “A”.
Ordering information
Part options
[1]
[2]
[2]
[2]
[2]
4.1 Ordering options
[3]
[3]
[3]
[3]
SRAM (kB)
128
256
256
256
128
256
256
256
Package
Name
TFBGA296
TFBGA296
TFBGA296
TFBGA296
TFBGA296
TFBGA296
TFBGA296
TFBGA296
All information provided in this document is subject to legal disclaimers.
10/100 Ethernet
0
0
1
1
0
0
1
1
Rev. 01.03 — 16 March 2010
Description
plastic thin fine-pitch ball grid array package; 296 balls SOT1048-1
plastic thin fine-pitch ball grid array package; 296 balls SOT1048-1
plastic thin fine-pitch ball grid array package; 296 balls SOT1048-1
plastic thin fine-pitch ball grid array package; 296 balls SOT1048-1
plastic thin fine-pitch ball grid array package; 296 balls SOT1048-1
plastic thin fine-pitch ball grid array package; 296 balls SOT1048-1
plastic thin fine-pitch ball grid array package; 296 balls SOT1048-1
plastic thin fine-pitch ball grid array package; 296 balls SOT1048-1
LCD
controller
0
1
0
1
0
1
0
1
Temperature range (°C)
−40 to +85
−40 to +85
−40 to +85
−40 to +85
−40 to +85
−40 to +85
−40 to +85
−40 to +85
LPC3220/30/40/50
16/32-bit ARM microcontrollers
© NXP B.V. 2010. All rights reserved.
Version
Package
TFBGA296
TFBGA296
TFBGA296
TFBGA296
TFBGA296
TFBGA296
TFBGA296
TFBGA296
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