LPC3230FET296,551 NXP Semiconductors, LPC3230FET296,551 Datasheet - Page 61

• Manufacturer Part Number: LPC3230FET296,551
• Description: IC ARM9 MCU 256K 296-TFBGA
• Manufacturer: NXP Semiconductors
• Series: LPC32x0r

Specifications of LPC3230FET296,551

• Core Processor: ARM9
• Core Size: 16/32-Bit
• Speed: 266MHz
• Connectivity: EBI/EMI, I²C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
• Peripherals: DMA, I²S, LCD, Motor Control PWM, PWM, WDT
• Number Of I /o: 51
• Program Memory Type: ROMless
• Ram Size: 256K x 8
• Voltage - Supply (vcc/vdd): 0.9 V ~ 3.6 V
• Data Converters: A/D 3x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 296-TFBGA
• Processor Series: LPC32
• Core: ARM926EJ-S
• Data Bus Width: 32 bit
• Data Ram Size: 256 KB
• Interface Type: I2C, I2S, UART, USB
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 51
• Number Of Timers: 6
• Operating Supply Voltage: 2.7 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 8 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -
• Lead Free Status / Rohs Status: Details
• Other names: 568-4531; 935287119551

NXP Semiconductors
Table 15.
V
[1]
Table 16.
T
[1]
[2]
LPC3220_30_40_50_1
Product data sheet
Symbol Parameter
T
t
t
t
t
Symbol
t
t
su(D)
h(D)
d(QV)
h(Q)
DD(IO)
amb
TIO
TOI
cy(clk)
Parameters are valid over operating temperature range unless otherwise specified.
Parameters are valid over operating temperature range unless otherwise specified.
Typical ratings are not guaranteed. The values listed are at room temperature (25 °C), nominal supply voltages.
=
−
= 3.3 V; T
40
clock cycle time
data input set-up time
data input hold time
data output valid delay time
data output hold time
°
Dynamic characteristics USB digital I/O pins
Dynamic characteristics: SD card pin interface
C to +85
Parameter
bus turnaround time (I/O)
bus turnaround time (O/I)
11.5 USB controller
11.6 Secure Digital (SD) card interface
amb
=
°
C for industrial applications; V
−
40
Fig 13. USB bus turnaround time
°
C to +85
USB_DAT_VP
USB_SE0_VM
USB_OE_TP
°
C, unless otherwise specified.
All information provided in this document is subject to legal disclaimers.
Conditions
on pin MS_SCLK; Data transfer mode
on pin MS_SCLK; Identification mode
on pins MS_BS, MS_DIO[3:0] as inputs
on pins MS_BS, MS_DIO[3:0] as inputs
on pins MS_BS, MS_DIO[3:0] as outputs
on pins MS_BS, MS_DIO[3:0] as outputs
Conditions
OE_N/INT_N to DAT/VP and SE0/VM
OE_N/INT_N to DAT/VP and SE0/VM
Rev. 01.03 — 16 March 2010
DD(IO)
input
over specified ranges.
t
TIO
[1]
output
[1]
LPC3220/30/40/50
t
Min
-
-
TOI
16/32-bit ARM microcontrollers
Min
-
-
-
-
-
-
Typ
7
0
Typ
-
-
2.7
0
9.7
7.7
input
[2]
© NXP B.V. 2010. All rights reserved.
002aae440
Max
-
-
Max
25
400
-
-
-
-
Unit
MHz
kHz
ns
ns
ns
ns
61 of 77
Unit
ns
ns