LPC3230FET296,551 NXP Semiconductors, LPC3230FET296,551 Datasheet - Page 52

IC ARM9 MCU 256K 296-TFBGA

LPC3230FET296,551

Manufacturer Part Number
LPC3230FET296,551
Description
IC ARM9 MCU 256K 296-TFBGA
Manufacturer
NXP Semiconductors
Series
LPC32x0r
Datasheet

Specifications of LPC3230FET296,551

Core Processor
ARM9
Core Size
16/32-Bit
Speed
266MHz
Connectivity
EBI/EMI, I²C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals
DMA, I²S, LCD, Motor Control PWM, PWM, WDT
Number Of I /o
51
Program Memory Type
ROMless
Ram Size
256K x 8
Voltage - Supply (vcc/vdd)
0.9 V ~ 3.6 V
Data Converters
A/D 3x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
296-TFBGA
Processor Series
LPC32
Core
ARM926EJ-S
Data Bus Width
32 bit
Data Ram Size
256 KB
Interface Type
I2C, I2S, UART, USB
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
51
Number Of Timers
6
Operating Supply Voltage
2.7 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
MDK-ARM, RL-ARM, ULINK2
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 8 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Lead Free Status / Rohs Status
 Details
Other names
568-4531
935287119551

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
LPC3230FET296,551
Manufacturer:
NXP Semiconductors
Quantity:
10 000
NXP Semiconductors
LPC3220_30_40_50_1
Product data sheet
10.4 Power consumption in Run mode
Power consumption is shown in
conditions from SDRAM. MMU and I-cache/D-cache are enabled. The VFP is turned on
but not used. I
touchscreen ADC, and UART3 are turned on. All other peripherals are turned off.
The AHB clock HCLK is identical to the core clock for frequencies up to 133 MHz, which is
the maximum allowed HCLK frequency. For higher core frequencies, the HCLK PLL
output must be divided by 2 to obtain an HCLK frequency lower than or equal to 133 MHz
resulting in correspondingly lower power consumption by the AHB peripherals.
Fig 5.
(1) WinCE running from SDRAM; playing wmv file at 20 frames/s, 32 kHz mono.
(2) WinCE running from SDRAM; playing mp3 file at 128 kbit/s, stereo.
(3) WinCE running from SDRAM; no application running.
I
DD(run)
(mA)
160
120
80
40
Conditions: T
VDD_CORE = 1.35 V for core frequencies > 208 MHz; V
Core current versus core frequency for WinCE applications
0
40
2
S-interface (channel 1), LCD, SLC NAND controller, I
All information provided in this document is subject to legal disclaimers.
amb
Rev. 01.03 — 16 March 2010
= 25 °C; VDD_CORE = 1.2 V for core frequencies ≤ 208 MHz;
Figure 5
120
HCLK = 133 MHz
HCLK = 72 MHz
for WinCE applications running under typical
VDD_CORE =
1.2 V
LPC3220/30/40/50
200
DD(IO)
16/32-bit ARM microcontrollers
core frequency (MHz)
= 1.8 V.
VDD_CORE =
1.35 V
2
C1-bus, SD card,
002aae762
© NXP B.V. 2010. All rights reserved.
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(2)
(3)
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