LPC3230FET296,551 NXP Semiconductors, LPC3230FET296,551 Datasheet - Page 62

• Manufacturer Part Number: LPC3230FET296,551
• Description: IC ARM9 MCU 256K 296-TFBGA
• Manufacturer: NXP Semiconductors
• Series: LPC32x0r

Specifications of LPC3230FET296,551

• Core Processor: ARM9
• Core Size: 16/32-Bit
• Speed: 266MHz
• Connectivity: EBI/EMI, I²C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
• Peripherals: DMA, I²S, LCD, Motor Control PWM, PWM, WDT
• Number Of I /o: 51
• Program Memory Type: ROMless
• Ram Size: 256K x 8
• Voltage - Supply (vcc/vdd): 0.9 V ~ 3.6 V
• Data Converters: A/D 3x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 296-TFBGA
• Processor Series: LPC32
• Core: ARM926EJ-S
• Data Bus Width: 32 bit
• Data Ram Size: 256 KB
• Interface Type: I2C, I2S, UART, USB
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 51
• Number Of Timers: 6
• Operating Supply Voltage: 2.7 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 8 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -
• Lead Free Status / Rohs Status: Details
• Other names: 568-4531; 935287119551

NXP Semiconductors
Table 17.
T
[1]
[2]
[3]
[4]
[5]
[6]
[7]
[8]
LPC3220_30_40_50_1
Product data sheet
Symbol
t
t
t
t
t
t
t
t
t
t
CELREL
RC
REH
RHZ
RP
REHRBL
WB
WC
WH
WP
amb
T
CEA
W
W
R
RH = bitfield RD_HIGH [3:0] in register MLC_TIME_REG[15:12]
R
B
=
HCLK
L
HZ
D
L
H
−
= bitfield RD_LOW[3:0] in register MLC_TIME_REG[11:8]
= bitfield BUSY_DELAY[4:0] in register MLC_TIME_REG[23:19]
= bitfield WR_LOW[3:0] in register MLC_TIME_REG[3:0]
= bitfield WR_HIGH[3:0] in register MLC_TIME_REG[7:4]
40
= bitfield NAND_TA[2:0] in register MLC_TIME_REG[18:16]
D
= 1/HCLK
= bitfield TCEA_DELAY[1:0] in register MLC_TIME_REG[25:24]
°
Dynamic characteristics of the MLC NAND flash memory controller
C to +85
Parameter
CE LOW to RE LOW time
RE cycle time
RE HIGH hold time
RE HIGH to output high-impedance time
RE pulse width
RE HIGH to R/B LOW time
WE HIGH to R/B LOW time
WE cycle time
WE HIGH hold time
WE pulse width
11.7 MLC NAND flash memory controller
°
C.
Fig 14.
SD card pin interface timing
All information provided in this document is subject to legal disclaimers.
MS_DIO[3:0](O)
MS_DIO[3:0] (I)
MS_BS (O)
MS_SCLK
MS_BS (I)
Rev. 01.03 — 16 March 2010
[1][2]
[1][5][6]
[1][5][6]
[1][5][7]
[1][5]
[1][8]
[1][8]
[1][3][4]
[1][3][4]
[1][3]
Min
-
-
-
-
-
-
-
-
-
-
t
d(QV)
Typ
T
T
T
T
T
T
T
T
T
T
HCLK
HCLK
HCLK
HCLK
HCLK
HCLK
HCLK
HCLK
HCLK
HCLK
T
cy(clk)
× CEA
× (R
× (R
× (R
× (R
× B
× B
× (W
× (W
× (W
D
D
L
H
H
L
L
H
L
LPC3220/30/40/50
+ 1) + T
+ 1)
− R
− R
+ 1) + T
+ 1)
D
− W
t
su(D)
L
L
16/32-bit ARM microcontrollers
)
) + T
L
)
HCLK
t
HCLK
t
h(D)
h(Q)
HCLK
002aae441
× (R
× (W
× R
H
HZ
H
− R
− W
© NXP B.V. 2010. All rights reserved.
L
)
L
) -
Max
-
-
-
-
-
-
-
-
-
62 of 77
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns