AT91M55800A-33CJ Atmel, AT91M55800A-33CJ Datasheet - Page 255

IC ARM MCU 16BIT 176BGA

AT91M55800A-33CJ

Manufacturer Part Number
AT91M55800A-33CJ
Description
IC ARM MCU 16BIT 176BGA
Manufacturer
Atmel
Series
AT91SAMr
Datasheets

Specifications of AT91M55800A-33CJ

Core Processor
ARM7
Core Size
16/32-Bit
Speed
33MHz
Connectivity
EBI/EMI, SPI, UART/USART
Peripherals
POR, WDT
Number Of I /o
58
Program Memory Type
ROMless
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
176-LFBGA
Processor Series
AT91Mx
Core
ARM7TDMI
Data Bus Width
32 bit
Data Ram Size
8 KB
Interface Type
EBI, SPI, USART
Maximum Clock Frequency
33 MHz
Number Of Programmable I/os
58
Number Of Timers
10 bit
Operating Supply Voltage
3 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
JTRACE-ARM-2M, MDK-ARM, RL-ARM, ULINK2
Development Tools By Supplier
AT91EB55
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 8 Channel
On-chip Dac
8 bit, 2 Channel
Cpu Family
AT91
Device Core
ARM7TDMI
Device Core Size
32b
Frequency (max)
33MHz
Program Memory Size
Not Required
Total Internal Ram Size
8KB
# I/os (max)
58
Number Of Timers - General Purpose
6
Operating Supply Voltage (typ)
3.3V
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
2.7V
Instruction Set Architecture
RISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
176
Package Type
BGA
For Use With
AT91EB55 - KIT EVAL FOR ARM AT91M55800A
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Program Memory Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

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iv
AT91M5880A
21 ADC: Analog-to-digital Converter ...................................................... 212
22 DAC: Digital-to-Analog Converter ...................................................... 224
23 JTAG Boundary-scan Register ........................................................... 233
24 Packaging Information ........................................................................ 241
25 Soldering Profile .................................................................................. 244
26 Ordering Information .......................................................................... 245
27 Errata ..................................................................................................... 246
Revision History.................................................................................... 251
Table of Contents....................................................................................... i
20.5Clock Generation .................................................................................................197
20.6Peripheral Data Controller ...................................................................................197
20.7SPI User Interface ...............................................................................................198
22.1Conversion Details ..............................................................................................224
22.2DAC User Interface .............................................................................................226
25.1LQFP Soldering Profile (Green) ..........................................................................244
25.2BGA Soldering Profile (RoHS-compliant) ............................................................244
27.1ADC Characteristics and Behavior ......................................................................246
27.2Warning: Additional NWAIT Constraints ..............................................................246
27.3Unpredictable Result in APMC State Machine on Switch from Oscillator to PLL 249
27.4Clock Switching with the Prescaler in the APMC is not Permitted ......................249
27.5Initializing SPI in Master Mode May Cause a Mode Fault Detection ...................249
27.6SPI in Slave Mode does not Work .......................................................................250
27.7VDDBU Consumption is not Guaranteed ............................................................250
27.8VDDCORE Current Consumption when PLL is not Used ...................................250
1745F–ATARM–06-Sep-07

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