ATSAM3S4CA-CU Atmel, ATSAM3S4CA-CU Datasheet - Page 10

• Manufacturer Part Number: ATSAM3S4CA-CU
• Description: IC MCU 32BIT 256KB FLASH 100BGA
• Manufacturer: Atmel
• Series: SAM3Sr

Specifications of ATSAM3S4CA-CU

• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 64MHz
• Connectivity: EBI/EMI, I²C, MMC, SPI, SSC, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
• Number Of I /o: 79
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 48K x 8
• Voltage - Supply (vcc/vdd): 1.62 V ~ 1.95 V
• Data Converters: A/D 16x10/12b, D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 100-LFBGA
• Processor Series: ATSAM3x
• Core: ARM Cortex M3
• 3rd Party Development Tools: JTRACE-CM3, MDK-ARM, RL-ARM, ULINK2
• Development Tools By Supplier: ATSAM3S-EK
• Package: 100LFBGA
• Device Core: ARM Cortex M3
• Family Name: AT91
• Maximum Speed: 64 MHz
• Operating Supply Voltage: 1.8|3.3 V
• Data Bus Width: 32 Bit
• Number Of Programmable I/os: 79
• Interface Type: I2C/I2S/SPI/UART/USART/USB
• On-chip Adc: 16-chx12-bit
• On-chip Dac: 2-chx12-bit
• Number Of Timers: 6
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

4. Package and Pinout
4.1
4.1.1
4.1.2
10
SAM3S4/2/1C Package and Pinout
SAM3S Preliminary
100-lead LQFP Package Outline
100-ball LFBGA Package Outline
Figure 4-2
Figure 4-1.
The 100-Ball LFBGA package has a 0.8 mm ball pitch and respects Green Standards. Its dimen-
sions are 9 x 9 x 1.1 mm.
Figure 4-2.
shows the orientation of the 100-ball LFBGA Package
Orientation of the 100-lead LQFP Package
Orientation of the 100-BALL LFBGA Package
100
76
BALL A1
10
9
8
7
6
5
4
2
3
1
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6500C–ATARM–8-Feb-11