ATSAM3S4CA-CU Atmel, ATSAM3S4CA-CU Datasheet - Page 1094

IC MCU 32BIT 256KB FLASH 100BGA

ATSAM3S4CA-CU

Manufacturer Part Number
ATSAM3S4CA-CU
Description
IC MCU 32BIT 256KB FLASH 100BGA
Manufacturer
Atmel
Series
SAM3Sr
Datasheets

Specifications of ATSAM3S4CA-CU

Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
64MHz
Connectivity
EBI/EMI, I²C, MMC, SPI, SSC, UART/USART, USB
Peripherals
Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number Of I /o
79
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
48K x 8
Voltage - Supply (vcc/vdd)
1.62 V ~ 1.95 V
Data Converters
A/D 16x10/12b, D/A 2x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
100-LFBGA
Processor Series
ATSAM3x
Core
ARM Cortex M3
3rd Party Development Tools
JTRACE-CM3, MDK-ARM, RL-ARM, ULINK2
Development Tools By Supplier
ATSAM3S-EK
Package
100LFBGA
Device Core
ARM Cortex M3
Family Name
AT91
Maximum Speed
64 MHz
Operating Supply Voltage
1.8|3.3 V
Data Bus Width
32 Bit
Number Of Programmable I/os
79
Interface Type
I2C/I2S/SPI/UART/USART/USB
On-chip Adc
16-chx12-bit
On-chip Dac
2-chx12-bit
Number Of Timers
6
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
 Details

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
ATSAM3S4CA-CU
Manufacturer:
SANYO
Quantity:
1 000
Part Number:
ATSAM3S4CA-CU
Manufacturer:
Atmel
Quantity:
10 000
Part Number:
ATSAM3S4CA-CUR
Manufacturer:
Atmel
Quantity:
10 000
42.1
42.2
1094
Soldering Profile
Packaging Resources
SAM3S Preliminary
Table 42-18
Table 42-18. Soldering Profile
Note:
A maximum of three reflow passes is allowed per component.
Land Pattern Definition.
Refer to the following IPC Standards:
Profile Feature
Average Ramp-up Rate (217°C to Peak)
Preheat Temperature 175°C ±25°C
Temperature Maintained Above 217°C
Time within 5° C of Actual Peak Temperature
Peak Temperature Range
Ramp-down Rate
Time 25° C to Peak Temperature
• IPC-7351A and IPC-782 (Generic Requirements for Surface Mount Design and Land Pattern
• Atmel Green and RoHS Policy and Package Material Declaration Data Sheet
Standards)
http://www.atmel.com/green/
The package is certified to be backward compatible with Pb/Sn soldering profile.
gives the recommended soldering profile from J-STD-020C.
http://landpatterns.ipc.org/default.asp
Green Package
3° C/sec. max.
180 sec. max.
60 sec. to 150 sec.
20 sec. to 40 sec.
260° C
6° C/sec. max.
8 min. max.
6500C–ATARM–8-Feb-11

Related parts for ATSAM3S4CA-CU