MC9S12C64CFUE Freescale Semiconductor, MC9S12C64CFUE Datasheet - Page 167

IC MCU 64K FLASH 4K RAM 80-QFP

MC9S12C64CFUE

Manufacturer Part Number
MC9S12C64CFUE
Description
IC MCU 64K FLASH 4K RAM 80-QFP
Manufacturer
Freescale Semiconductor
Series
HCS12r
Datasheets

Specifications of MC9S12C64CFUE

Core Processor
HCS12
Core Size
16-Bit
Speed
25MHz
Connectivity
CAN, EBI/EMI, SCI, SPI
Peripherals
POR, PWM, WDT
Number Of I /o
60
Program Memory Size
64KB (64K x 8)
Program Memory Type
FLASH
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
2.35 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
80-QFP
Processor Series
S12C
Core
HCS12
Data Bus Width
16 bit
Data Ram Size
4 KB
Interface Type
CAN/SCI/SPI
Maximum Clock Frequency
25 MHz
Number Of Programmable I/os
60
Number Of Timers
8
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWHCS12
Development Tools By Supplier
M68EVB912C32EE
Minimum Operating Temperature
- 40 C
On-chip Adc
8-ch x 10-bit
Package
80PQFP
Family Name
HCS12
Maximum Speed
25 MHz
Operating Supply Voltage
2.5|5 V
Height
2.4 mm
Length
14 mm
Supply Voltage (max)
2.75 V, 5.5 V
Supply Voltage (min)
2.35 V, 2.97 V
Width
14 mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

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6.2
A single-wire interface pin is used to communicate with the BDM system. Two additional pins are used
for instruction tagging. These pins are part of the multiplexed external bus interface (MEBI) sub-block and
all interfacing between the MEBI and BDM is done within the core interface boundary. Functional
descriptions of the pins are provided below for completeness.
6.2.1
Debugging control logic communicates with external devices serially via the single-wire background
interface pin (BKGD). During reset, this pin is a mode select input which selects between normal and
special modes of operation. After reset, this pin becomes the dedicated serial interface pin for the
background debug mode.
6.2.2
This pin is used to tag the high byte of an instruction. When instruction tagging is on, a logic 0 at the falling
edge of the external clock (ECLK) tags the high half of the instruction word being read into the instruction
queue.
6.2.3
This pin is used to tag the low byte of an instruction. When instruction tagging is on and low strobe is
enabled, a logic 0 at the falling edge of the external clock (ECLK) tags the low half of the instruction word
being read into the instruction queue.
Freescale Semiconductor
BKGD — Background interface pin
TAGHI — High byte instruction tagging pin
TAGLO — Low byte instruction tagging pin
BKGD and TAGHI share the same pin.
TAGLO and LSTRB share the same pin.
External Signal Description
BKGD — Background Interface Pin
TAGHI — High Byte Instruction Tagging Pin
TAGLO — Low Byte Instruction Tagging Pin
Generally these pins are shared as described, but it is best to check the
device overview chapter to make certain. All MCUs at the time of this
writing have followed this pin sharing scheme.
MC9S12C-Family / MC9S12GC-Family
Rev 01.24
NOTE
Chapter 6 Background Debug Module (BDMV4) Block Description
167

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