MC68HC16Z1CAG25 Freescale Semiconductor, MC68HC16Z1CAG25 Datasheet - Page 107

• Manufacturer Part Number: MC68HC16Z1CAG25
• Description: IC MCU 16BIT 25MHZ 144-LQFP
• Manufacturer: Freescale Semiconductor
• Series: HC16r

Specifications of MC68HC16Z1CAG25

• Core Processor: CPU16
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: EBI/EMI, SCI, SPI
• Peripherals: POR, PWM, WDT
• Number Of I /o: 16
• Program Memory Type: ROMless
• Ram Size: 1K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 144-LQFP
• Cpu Family: HC16
• Device Core Size: 16b
• Frequency (max): 25MHz
• Interface Type: SCI/SPI/UART
• Program Memory Size: Not Required
• Total Internal Ram Size: 1KB
• # I/os (max): 16
• Number Of Timers - General Purpose: 11
• Operating Supply Voltage (typ): 3.3/5V
• Operating Supply Voltage (max): 5.5V
• Operating Supply Voltage (min): 2.7V
• On-chip Adc: 8-chx10-bit
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 144
• Package Type: LQFP
• Controller Family/series: 68HC16
• No. Of I/o's: 16
• Ram Memory Size: 1KB
• Cpu Speed: 25MHz
• No. Of Timers: 2
• Embedded Interface Type: QSPI, SCI
• Rohs Compliant: Yes
• Processor Series: HC16Z
• Core: CPU16
• Data Bus Width: 16 bit
• Data Ram Size: 1 KB
• Maximum Clock Frequency: 25 MHz
• Number Of Programmable I/os: 16
• Number Of Timers: 11
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -
• Lead Free Status / Rohs Status: Compliant

5.1 General
M68HC16 Z SERIES
USER’S MANUAL
This section is an overview of the system integration module (SIM). Refer to the SIM
Reference Manual (SIMRM/AD) for a comprehensive discussion of SIM capabilities.
Refer to
map and register structure.
The SIM consists of six functional blocks.
SIM.
The system configuration block controls MCU configuration parameters.
The system clock generates clock signals used by the SIM, other IMB modules, and
external devices.
The system protection block provides bus and software watchdog monitors. In addi-
tion, it also provides a periodic interrupt timer to support execution of time-critical con-
trol routines.
The external bus interface handles the transfer of information between IMB modules
and external address space.
The chip-select block provides 12 chip-select signals. Each chip-select signal has an
associated base address register and option register that contain the programmable
characteristics of that chip-select.
The system test block incorporates hardware necessary for testing the MCU. It is used
to perform factory tests, and its use in normal applications is not supported.
D.2 System Integration Module
SYSTEM INTEGRATION MODULE
Freescale Semiconductor, Inc.
For More Information On This Product,
SYSTEM INTEGRATION MODULE
Go to: www.freescale.com
SECTION 5
for information concerning the SIM address
Figure 5-1
shows a block diagram of the
5-1