MC68HC16Z1CAG25 Freescale Semiconductor, MC68HC16Z1CAG25 Datasheet - Page 363

• Manufacturer Part Number: MC68HC16Z1CAG25
• Description: IC MCU 16BIT 25MHZ 144-LQFP
• Manufacturer: Freescale Semiconductor
• Series: HC16r

Specifications of MC68HC16Z1CAG25

• Core Processor: CPU16
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: EBI/EMI, SCI, SPI
• Peripherals: POR, PWM, WDT
• Number Of I /o: 16
• Program Memory Type: ROMless
• Ram Size: 1K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 144-LQFP
• Cpu Family: HC16
• Device Core Size: 16b
• Frequency (max): 25MHz
• Interface Type: SCI/SPI/UART
• Program Memory Size: Not Required
• Total Internal Ram Size: 1KB
• # I/os (max): 16
• Number Of Timers - General Purpose: 11
• Operating Supply Voltage (typ): 3.3/5V
• Operating Supply Voltage (max): 5.5V
• Operating Supply Voltage (min): 2.7V
• On-chip Adc: 8-chx10-bit
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 144
• Package Type: LQFP
• Controller Family/series: 68HC16
• No. Of I/o's: 16
• Ram Memory Size: 1KB
• Cpu Speed: 25MHz
• No. Of Timers: 2
• Embedded Interface Type: QSPI, SCI
• Rohs Compliant: Yes
• Processor Series: HC16Z
• Core: CPU16
• Data Bus Width: 16 bit
• Data Ram Size: 1 KB
• Maximum Clock Frequency: 25 MHz
• Number Of Programmable I/os: 16
• Number Of Timers: 11
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -
• Lead Free Status / Rohs Status: Compliant

M68HC16 Z SERIES
USER’S MANUAL
PIN 1
IDENT
L
C
J
36
1
4X
SECTION J1–J1
0.08
144
37
Ç Ç Ç
É É É
Ç Ç Ç
É É É
Ç Ç Ç
É É É
(ROTATED 90 )
0.20 T L–M
144 PL
M
S1
D
F
A1
T L–M
Figure B-6 Case 918 — 144-Pin Package Dimensions
_
N
N
MECHANICAL DATA AND ORDERING INFORMATION
A
S
PLATING
BASE
METAL
AA
Freescale Semiconductor, Inc.
For More Information On This Product,
N
VIEW Y
q
q
2
4X 36 TIPS
2
C2
C1
109
Go to: www.freescale.com
72
0.05
VIEW AB
108
73
T
0.20 T L–M
(Y)
M
q
VIEW AB
0.1
B1 V1
SEATING
PLANE
T
(Z)
144X
N
(K)
E
B
R2
V
R1
C L
GAGE PLANE
q
0.25
1
NOTES:
1. DIMENSIONS AND TOLERANCING PER ASME
2. DIMENSIONS IN MILLIMETERS.
3. DATUMS L, M, N TO BE DETERMINED AT THE
4. DIMENSIONS S AND V TO BE DETERMINED AT
5. DIMENSIONS A AND B DO NOT INCLUDE MOLD
6. DIMENSION D DOES NOT INCLUDE DAMBAR
Y14.5M, 1994.
SEATING PLANE, DATUM T.
SEATING PLANE, DATUM T.
PROTRUSION. ALLOWABLE PROTRUSION IS
0.25 PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE H.
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL NOT CAUSE THE D
DIMENSION TO EXCEED 0.35.
DIM
AA
A1
B1
C1
C2
R1
R2
S1
V1
q
q
A
B
C
D
E
F
G
K
P
S
V
Y
Z
q
J
VIEW Y
1
2
MILLIMETERS
MIN
1.40
0.05
1.35
0.17
0.45
0.17
0.09
0.13
0.13
0.09
20.00 BSC
10.00 BSC
20.00 BSC
10.00 BSC
22.00 BSC
11.00 BSC
22.00 BSC
11.00 BSC
11
0.50 BSC
0.25 REF
1.00 REF
0.50 REF
0.25 BSC
0
0
_
_
_
J1
J1
MAX
1.60
0.15
1.45
0.27
0.75
0.23
0.20
0.20
0.20
0.16
140X
13
7
_
_
4X
G
X=L, M OR N
X
P
B-7